JPH0397955U - - Google Patents
Info
- Publication number
- JPH0397955U JPH0397955U JP623390U JP623390U JPH0397955U JP H0397955 U JPH0397955 U JP H0397955U JP 623390 U JP623390 U JP 623390U JP 623390 U JP623390 U JP 623390U JP H0397955 U JPH0397955 U JP H0397955U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- solder bridges
- board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 3
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例によるプリント配
線板を部品搭載面から見た透視図、第２図は半田
付け後の状態を示したプリント配線板の断面図、
第３図は考案の他の実施例を示すプリント配線板
を部品搭載面から見た平面図、第４図は半田付け
後の状態を示したプリント配線板の断面図、第５
図は従来のプリント配線板を部品搭載面から見た
透視図、第６図は、半田付け後の状態を示したプ
リント配線板の断面図である。
図において、１……パターン、２……スルーホ
ール、３……ソルダーレジスト、４……スルーホ
ール間接続パターン、５……目印、６……基材、
７……リードである。なお、図中、同一符号は同
一、または相当部分を示す。
FIG. 1 is a perspective view of a printed wiring board according to an embodiment of this invention, seen from the component mounting surface, and FIG. 2 is a cross-sectional view of the printed wiring board showing the state after soldering.
Fig. 3 is a plan view of a printed wiring board showing another embodiment of the invention as seen from the component mounting surface, Fig. 4 is a sectional view of the printed wiring board showing the state after soldering, and Fig. 5
The figure is a perspective view of a conventional printed wiring board seen from the component mounting surface, and FIG. 6 is a sectional view of the printed wiring board showing the state after soldering. In the figure, 1...pattern, 2...through hole, 3...solder resist, 4...connection pattern between through holes, 5...mark, 6...base material,
7...Lead. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
視検査を容易にするため、半田ブリツジ可否の即
断ができるよう、 シンボルプリント等で目印を設けたことを特徴
とするプリント配線板。[Scope of Claim for Utility Model Registration] Printed wiring characterized in that a mark is provided with a symbol print or the like to facilitate visual inspection of solder bridges after assembly of a printed wiring board is completed, so that it can be immediately determined whether solder bridges are possible or not. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623390U JPH0397955U (en) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623390U JPH0397955U (en) | 1990-01-26 | 1990-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397955U true JPH0397955U (en) | 1991-10-09 |
Family
ID=31509911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP623390U Pending JPH0397955U (en) | 1990-01-26 | 1990-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397955U (en) |
-
1990
- 1990-01-26 JP JP623390U patent/JPH0397955U/ja active Pending