JPH0323963U - - Google Patents

Info

Publication number
JPH0323963U
JPH0323963U JP8400489U JP8400489U JPH0323963U JP H0323963 U JPH0323963 U JP H0323963U JP 8400489 U JP8400489 U JP 8400489U JP 8400489 U JP8400489 U JP 8400489U JP H0323963 U JPH0323963 U JP H0323963U
Authority
JP
Japan
Prior art keywords
component
diameter
circuit board
printed circuit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8400489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8400489U priority Critical patent/JPH0323963U/ja
Publication of JPH0323963U publication Critical patent/JPH0323963U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案に係るプリント基板の実施例
を示す断面図である。第2図は従来の断面図であ
る。 符号の説明、1……部品の足、3……プリント
基板、4……部品面、5……パターン面、6……
孔、d……部品面からみた孔の直径、d……
パターン面からみた孔の直径。
FIG. 1 is a sectional view showing an embodiment of a printed circuit board according to this invention. FIG. 2 is a sectional view of a conventional device. Explanation of symbols, 1...Legs of parts, 3...Printed circuit board, 4...Component side, 5...Pattern side, 6...
Hole, d 1 ... Diameter of the hole seen from the part surface, d 2 ...
Diameter of the hole viewed from the pattern surface.

Claims (1)

【実用新案登録請求の範囲】 1 部品を装着するプリント基板において、 前記部品装着用の孔にテーパを設けたことを特
徴とするプリント基板。 2 パターン面からみた孔の直径は装着する部品
の直径に略等しいか、または、装着する部品の直
径より小さく形成したことを特徴とする請求項1
記載のプリント基板。
[Claims for Utility Model Registration] 1. A printed circuit board on which a component is mounted, characterized in that the hole for mounting the component is tapered. 2. Claim 1, wherein the diameter of the hole viewed from the pattern surface is approximately equal to or smaller than the diameter of the component to be mounted.
Printed circuit board as described.
JP8400489U 1989-07-19 1989-07-19 Pending JPH0323963U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8400489U JPH0323963U (en) 1989-07-19 1989-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8400489U JPH0323963U (en) 1989-07-19 1989-07-19

Publications (1)

Publication Number Publication Date
JPH0323963U true JPH0323963U (en) 1991-03-12

Family

ID=31632137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8400489U Pending JPH0323963U (en) 1989-07-19 1989-07-19

Country Status (1)

Country Link
JP (1) JPH0323963U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556200U (en) * 1992-01-09 1993-07-27 昭 奥 Prefabricated runway

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592175B2 (en) * 1978-07-28 1984-01-17 株式会社東芝 semiconductor equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592175B2 (en) * 1978-07-28 1984-01-17 株式会社東芝 semiconductor equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556200U (en) * 1992-01-09 1993-07-27 昭 奥 Prefabricated runway

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