JPH0390472U - - Google Patents
Info
- Publication number
- JPH0390472U JPH0390472U JP15082589U JP15082589U JPH0390472U JP H0390472 U JPH0390472 U JP H0390472U JP 15082589 U JP15082589 U JP 15082589U JP 15082589 U JP15082589 U JP 15082589U JP H0390472 U JPH0390472 U JP H0390472U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- chip
- chip component
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示すプリント配線基
板へチツプ部品を搭載したときの一部分を示す平
面図、第２図は従来のプリント配線基板へチツプ
部品を搭載したときの一部分を示す平面図である
。
１……チツプ部品、２……プリント配線基板、
３……銅箔パターン、４……レジストインク等の
マスキング、５……半田フイレツト、５ａ……半
田流れに対し陰にならない部分、５ｂ……半田流
れに対し陰になる部分、６……小径の孔、７……
大径の孔、８……半田流れ方向、２１……チツプ
部品、２２……プリント配線基板、２３……銅箔
パターン、２４……レジストインク等のマスキン
グ、２５……半田フイレツト、２６……半田流れ
方向。
Fig. 1 is a plan view showing a portion of a chip component mounted on a printed wiring board according to an embodiment of the present invention, and Fig. 2 is a plan view showing a portion of a conventional printed wiring board when chip components are mounted. It is. 1... Chip parts, 2... Printed wiring board,
3...Copper foil pattern, 4...Masking of resist ink, etc., 5...Solder fillet, 5a...A portion not shaded by the solder flow, 5b...A portion shaded by the solder flow, 6...Small diameter hole, 7...
Large diameter hole, 8... Solder flow direction, 21... Chip component, 22... Printed wiring board, 23... Copper foil pattern, 24... Masking for resist ink, etc., 25... Solder fillet, 26... Direction of solder flow.
Claims (1)
板にあつて、銅箔パターンおよびチツプ部品を搭
載するための半田フイレツトをそれぞれ形成した
プリント配線基板を設け、少なくとも半田流れに
対し陰になる側の前記チツプ部品の前記半田フイ
レツトの形状を暫時同チツプ部品側に向けて広く
なるよう形成し、一方を大なる孔とし同孔を前記
チツプ部品側とする直径の異なる少なくとも二つ
の孔を同チツプ部品側に向けて広くなるよう形成
した前記半田フイレツト内に設け、角形のチツプ
部品を設け同チツプ部品を前記プリント配線基板
の前記半田フイレツト間に仮固着し噴流する半田
を用いて同チツプ部品を固着するようにしてなる
チツプ部品の半田付構造。 A printed wiring board used in electronic equipment and subjected to surface mounting is provided with a printed wiring board on which a copper foil pattern and a solder fillet for mounting chip components are respectively formed, and at least the side of the chip that is shaded from the solder flow is provided. The shape of the solder fillet of the component is temporarily formed so that it becomes wider toward the chip component side, and at least two holes with different diameters are formed on the same chip component side, with one hole being a large hole and the same hole being the chip component side. A rectangular chip component is provided within the solder fillet formed to be wider toward the solder fillet, and the chip component is temporarily fixed between the solder fillets of the printed wiring board, and the chip component is fixed using jetted solder. Soldering structure for chip parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15082589U JPH0390472U (en) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15082589U JPH0390472U (en) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390472U true JPH0390472U (en) | 1991-09-13 |
Family
ID=31697157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15082589U Pending JPH0390472U (en) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390472U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007122499A (en) * | 2005-10-28 | 2007-05-17 | Ricoh Co Ltd | Writing information processing system, and writing information processing method and program |
| JP4721052B2 (en) * | 2004-01-13 | 2011-07-13 | 日本電気株式会社 | Feature change image creation method, feature change image creation device, and feature change image creation program |
-
1989
- 1989-12-28 JP JP15082589U patent/JPH0390472U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4721052B2 (en) * | 2004-01-13 | 2011-07-13 | 日本電気株式会社 | Feature change image creation method, feature change image creation device, and feature change image creation program |
| JP2007122499A (en) * | 2005-10-28 | 2007-05-17 | Ricoh Co Ltd | Writing information processing system, and writing information processing method and program |