JPH032671U - - Google Patents
Info
- Publication number
- JPH032671U JPH032671U JP6192589U JP6192589U JPH032671U JP H032671 U JPH032671 U JP H032671U JP 6192589 U JP6192589 U JP 6192589U JP 6192589 U JP6192589 U JP 6192589U JP H032671 U JPH032671 U JP H032671U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- coating material
- soldering
- soldering flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 3
- 230000004907 flux Effects 0.000 claims 2
- 230000000740 bleeding effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案に係るプリント基板面の塗布
構造の実施例を示し、第１図はプリント基板の部
品取り付け面より見た平面図である。第２図は従
来例のプリント基板の平面図である。
主な符号の説明、１：プリント基板、１ｂ，１
ｂ：プリント基板上の部品取付穴、１ｃ：プリン
ト基板上の外周部、２：プリント基板上に塗布し
た塗布材、３：プリント基板上に印刷された文字
、４：プリント基板上に捺印される番号、５：従
来のプリント基板に塗布される塗布材。
FIG. 1 shows an embodiment of the coating structure for the printed circuit board surface according to this invention, and FIG. 1 is a plan view seen from the component mounting surface of the printed circuit board. FIG. 2 is a plan view of a conventional printed circuit board. Explanation of main symbols, 1: Printed circuit board, 1b, 1
b: Part mounting hole on the printed circuit board, 1c: Outer periphery on the printed circuit board, 2: Coating material applied on the printed circuit board, 3: Characters printed on the printed circuit board, 4: Stamped on the printed circuit board Number, 5: Coating material applied to conventional printed circuit boards.
Claims (1)
このハンダ付けのフラツクスの部品面への滲みを
防止する塗布材の塗布構造において、 プリント基板の部品取り付け穴と、プリント基
板の外周部などのハンダ付け用フラツクスが滲み
上がる箇所に上記塗布材を塗布して構成したこと
を特長とするプリント基板面の塗布構造。[Scope of claim for utility model registration] When soldering parts attached to a printed circuit board,
In this application structure of the coating material that prevents the soldering flux from bleeding onto the component surface, the coating material is applied to the parts where the soldering flux oozes, such as the component mounting holes of the printed circuit board and the outer periphery of the printed circuit board. A coating structure for the printed circuit board surface, which is characterized by being configured as follows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6192589U JPH032671U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6192589U JPH032671U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032671U true JPH032671U (en) | 1991-01-11 |
Family
ID=31590614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6192589U Pending JPH032671U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032671U (en) |
-
1989
- 1989-05-30 JP JP6192589U patent/JPH032671U/ja active Pending