JPH031476U - - Google Patents
Info
- Publication number
- JPH031476U JPH031476U JP5991789U JP5991789U JPH031476U JP H031476 U JPH031476 U JP H031476U JP 5991789 U JP5991789 U JP 5991789U JP 5991789 U JP5991789 U JP 5991789U JP H031476 U JPH031476 U JP H031476U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- printed
- solder resist
- silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案によるプリント配線基板の一実
施例の部分平面図、第２図は同プリント配線基板
に部品を装着した一例を示す部分断面図、第３図
は従来のプリント配線基板の部分正面図である。
図中、１，２，１１，１２はフツトパターン、
３，１３は半田付け領域、４，１４はソルダレジ
スト塗布若しくはシルク印刷、５は配線パターン
、６，１６はプリント配線基板、７はＩＣ、８は
ＩＣのリード端子である。
Fig. 1 is a partial plan view of an embodiment of a printed wiring board according to the present invention, Fig. 2 is a partial sectional view showing an example of mounting components on the same printed wiring board, and Fig. 3 is a portion of a conventional printed wiring board. It is a front view. In the figure, 1, 2, 11, 12 are foot patterns,
3 and 13 are soldering areas, 4 and 14 are solder resist coatings or silk printing, 5 is a wiring pattern, 6 and 16 are printed wiring boards, 7 is an IC, and 8 is a lead terminal of the IC.
Claims (1)
半田付け箇所の両側に、ソルダレジストを塗布若
しくはシルク印刷したことを特徴とするプリント
配線基板。 A printed wiring board characterized in that a solder resist is coated or silk-printed on both sides of a soldering location of a foot pattern provided on the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5991789U JPH031476U (en) | 1989-05-24 | 1989-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5991789U JPH031476U (en) | 1989-05-24 | 1989-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031476U true JPH031476U (en) | 1991-01-09 |
Family
ID=31586839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5991789U Pending JPH031476U (en) | 1989-05-24 | 1989-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222386A (en) * | 2005-02-14 | 2006-08-24 | Toshiba Corp | Printed wiring board, printed circuit board, and electronic apparatus |
-
1989
- 1989-05-24 JP JP5991789U patent/JPH031476U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222386A (en) * | 2005-02-14 | 2006-08-24 | Toshiba Corp | Printed wiring board, printed circuit board, and electronic apparatus |