JPH0331574U - - Google Patents
Info
- Publication number
- JPH0331574U JPH0331574U JP8988389U JP8988389U JPH0331574U JP H0331574 U JPH0331574 U JP H0331574U JP 8988389 U JP8988389 U JP 8988389U JP 8988389 U JP8988389 U JP 8988389U JP H0331574 U JPH0331574 U JP H0331574U
- Authority
- JP
- Japan
- Prior art keywords
- solder printing
- metal mask
- cream solder
- electronic components
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案の一実施例を示す説明図、第
２図は従来例の説明図である。
１，６……メタルマスク、２，７……半田孔、
３……配線基板、４……パターン、５，８……印
刷された半田を示す。
FIG. 1 is an explanatory diagram showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram of a conventional example. 1, 6...metal mask, 2,7...solder hole,
3... Wiring board, 4... Pattern, 5, 8... Printed solder.
Claims (1)
るクリーム半田印刷用メタルマスクに於いて、半
田印刷箇所に穿設される半田孔を複数のパターン
に掛渡る形状としたことを特徴とするクリーム半
田印刷用メタルマスク。 Cream solder printing is characterized by a metal mask for cream solder printing used when mounting electronic components on wiring boards, in which the solder holes drilled at the solder printing locations are shaped to span multiple patterns. metal mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8988389U JPH0331574U (en) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8988389U JPH0331574U (en) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0331574U true JPH0331574U (en) | 1991-03-27 |
Family
ID=31639436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8988389U Pending JPH0331574U (en) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0331574U (en) |
-
1989
- 1989-07-31 JP JP8988389U patent/JPH0331574U/ja active Pending
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