JPS6219777U - - Google Patents
Info
- Publication number
- JPS6219777U JPS6219777U JP11047485U JP11047485U JPS6219777U JP S6219777 U JPS6219777 U JP S6219777U JP 11047485 U JP11047485 U JP 11047485U JP 11047485 U JP11047485 U JP 11047485U JP S6219777 U JPS6219777 U JP S6219777U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- printing plate
- positioning hole
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案になる印刷版の位置決め機構の
一実施例を示す図、第２図は第１図に示した印刷
版をプリント配線板の上に載置した状態を示す図
、第３図は本考案になる印刷版の位置決め機構の
他の実施例を示す図、第４図は従来の印刷版を示
す図、第５図は印刷版を用いてクリーム半田をプ
リント配線板に印刷（塗布）する状態を説明する
ための図である。
１……プリント配線板、２……置台、３……回
路パターン、４，１２……印刷用の透孔、５，１
１……印刷版、６，１３……金属板（メタルマス
ク）、７……枠、８……スキージ、９……位置決
め用の透孔、１０……位置決め用の突起、Ｓ……
クリーム半田。
FIG. 1 is a diagram showing an embodiment of the printing plate positioning mechanism according to the present invention, FIG. 2 is a diagram showing the printing plate shown in FIG. 1 placed on a printed wiring board, and FIG. The figure shows another embodiment of the printing plate positioning mechanism according to the present invention, Fig. 4 shows a conventional printing plate, and Fig. 5 shows cream solder printed on a printed wiring board using the printing plate. FIG. 1... Printed wiring board, 2... Placement stand, 3... Circuit pattern, 4, 12... Through hole for printing, 5, 1
1... Printing plate, 6, 13... Metal plate (metal mask), 7... Frame, 8... Squeegee, 9... Through hole for positioning, 10... Protrusion for positioning, S...
Cream solder.
Claims (1)
成したプリント配線板と、 前記位置決め用の透孔に嵌挿する突起部を形成
すると共に、前記プリント配線板に形成された回
路パターンに対応する位置に印刷用の透孔を形成
した印刷版とからなる印刷版の位置決め機構。[Claims for Utility Model Registration] A printed wiring board having a predetermined circuit pattern and a positioning hole formed therein, a protrusion to be fitted into the positioning hole, and a printed wiring board formed on the printed wiring board. A printing plate positioning mechanism consisting of a printing plate with printing holes formed at positions corresponding to printed circuit patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11047485U JPS6219777U (en) | 1985-07-19 | 1985-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11047485U JPS6219777U (en) | 1985-07-19 | 1985-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6219777U true JPS6219777U (en) | 1987-02-05 |
Family
ID=30989506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11047485U Pending JPS6219777U (en) | 1985-07-19 | 1985-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6219777U (en) |
-
1985
- 1985-07-19 JP JP11047485U patent/JPS6219777U/ja active Pending