JPS61125076U - - Google Patents

Info

Publication number
JPS61125076U
JPS61125076U JP983585U JP983585U JPS61125076U JP S61125076 U JPS61125076 U JP S61125076U JP 983585 U JP983585 U JP 983585U JP 983585 U JP983585 U JP 983585U JP S61125076 U JPS61125076 U JP S61125076U
Authority
JP
Japan
Prior art keywords
wiring
pattern
board
printed wiring
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP983585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP983585U priority Critical patent/JPS61125076U/ja
Publication of JPS61125076U publication Critical patent/JPS61125076U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の1実施例に於ける接続構造の
分解斜視図、第2図は本考案の1実施例に於ける
接続構造の平面図、第3図は従来に於ける接続構
造の分解斜視図、第4図は従来に於ける接続構造
の平面図である。 6,9…印刷配線基板、7,10…配線パター
ン、8…シンボルプリント。
Fig. 1 is an exploded perspective view of a connection structure in an embodiment of the present invention, Fig. 2 is a plan view of a connection structure in an embodiment of the invention, and Fig. 3 is a diagram of a conventional connection structure. The exploded perspective view and FIG. 4 are plan views of the conventional connection structure. 6, 9...Printed wiring board, 7,10...Wiring pattern, 8...Symbol print.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の印刷配線基板には接続用の配線パターン
を形成すると共に、この配線パターンの一部に半
田の不着物質を設け、また他方の印刷配線基板に
は上記配線パターンと電気的に接続される配線パ
ターンを形成し、それぞれの基板に形成された配
線パターンを半田により接続するようにしたこと
を特徴とする印刷配線基板の接続構造。
A wiring pattern for connection is formed on one printed wiring board, and a non-solder material is provided on a part of this wiring pattern, and wiring electrically connected to the wiring pattern is formed on the other printed wiring board. A connection structure for printed wiring boards, characterized in that a pattern is formed and the wiring patterns formed on each board are connected by solder.
JP983585U 1985-01-24 1985-01-24 Pending JPS61125076U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP983585U JPS61125076U (en) 1985-01-24 1985-01-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP983585U JPS61125076U (en) 1985-01-24 1985-01-24

Publications (1)

Publication Number Publication Date
JPS61125076U true JPS61125076U (en) 1986-08-06

Family

ID=30490430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP983585U Pending JPS61125076U (en) 1985-01-24 1985-01-24

Country Status (1)

Country Link
JP (1) JPS61125076U (en)

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