JPH034065U - - Google Patents
Info
- Publication number
- JPH034065U JPH034065U JP6251889U JP6251889U JPH034065U JP H034065 U JPH034065 U JP H034065U JP 6251889 U JP6251889 U JP 6251889U JP 6251889 U JP6251889 U JP 6251889U JP H034065 U JPH034065 U JP H034065U
- Authority
- JP
- Japan
- Prior art keywords
- paste
- solder paste
- hole
- metal mask
- chevron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Screen Printers (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の実施例に係るハンダペースト
用メタルマスクの構成を示す斜視図、第２図は第
１図のＡ−Ａ断面図、第３図は実施例のメタルマ
スクにて印刷をした直後の状態を示す図である。
１：フレーム、２：メタルマスク、３：ペース
ト抜け穴、３ａ：山型のテーパ、４：ハンダペー
スト、５：プリント基板、６：パツド。
Fig. 1 is a perspective view showing the configuration of a metal mask for solder paste according to an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1, and Fig. 3 shows printing using the metal mask of the embodiment. It is a figure which shows the state immediately after doing. 1: frame, 2: metal mask, 3: paste hole, 3a: chevron-shaped taper, 4: solder paste, 5: printed circuit board, 6: pad.
Claims (1)
ーストを印刷するハンダペースト用メタルマスク
において、上記ペースト抜け穴に山型のテーパを
設けたことを特徴とするハンダペースト用メタル
マスク。 A metal mask for solder paste for printing solder paste on a printed circuit board through a paste hole, characterized in that the paste hole is provided with a chevron-shaped taper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6251889U JPH034065U (en) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6251889U JPH034065U (en) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH034065U true JPH034065U (en) | 1991-01-16 |
Family
ID=31591741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6251889U Pending JPH034065U (en) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034065U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002192688A (en) * | 2000-12-25 | 2002-07-10 | Ibiden Co Ltd | Method for printing solder |
-
1989
- 1989-05-31 JP JP6251889U patent/JPH034065U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002192688A (en) * | 2000-12-25 | 2002-07-10 | Ibiden Co Ltd | Method for printing solder |