JPS61179770U - - Google Patents

Info

Publication number
JPS61179770U
JPS61179770U JP6187385U JP6187385U JPS61179770U JP S61179770 U JPS61179770 U JP S61179770U JP 6187385 U JP6187385 U JP 6187385U JP 6187385 U JP6187385 U JP 6187385U JP S61179770 U JPS61179770 U JP S61179770U
Authority
JP
Japan
Prior art keywords
land
circuit board
printed circuit
pattern
straight line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6187385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6187385U priority Critical patent/JPS61179770U/ja
Publication of JPS61179770U publication Critical patent/JPS61179770U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第2図aは面付けIC実装側面図、第2図bは
はんだペースト印刷状態図、第3図a,bは従来
の面付IC搭載位置決め状態図、第1図aはこの
考案の一実施例の拡大平面図、第1図bはこの考
案の一実施例の平面図である。 1:プリント基板、2:面付IC接続用ランド
、3:はんだペースト、4:面付IC、5:スリ
ツト、6:はんだペーストが乗らない部分、7:
回路パターン、8:回路パターンの直線部。
Figure 2a is a side view of the imposition IC mounting, Figure 2b is a diagram of the solder paste printing state, Figures 3a and b are diagrams of the conventional imposition IC mounting positioning state, and Figure 1a is an implementation of this invention. An enlarged plan view of an example, FIG. 1b is a plan view of an embodiment of the invention. 1: Printed circuit board, 2: Surface-mounted IC connection land, 3: Solder paste, 4: Surface-mounted IC, 5: Slit, 6: Part where solder paste does not cover, 7:
Circuit pattern, 8: Straight line part of the circuit pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板の面付IC接続用ランドにおいて
、当該ランドと接続される少なくとも1箇の回路
パターンを当該ランドの中心線上に配線させ、か
つ一定の直線部を保ちながら直角に配線させたこ
とを特徴とするプリント基板のパターン。
A surface-mounted IC connection land of a printed circuit board is characterized in that at least one circuit pattern connected to the land is routed on the center line of the land and at right angles while maintaining a certain straight line. printed circuit board pattern.
JP6187385U 1985-04-26 1985-04-26 Pending JPS61179770U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6187385U JPS61179770U (en) 1985-04-26 1985-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6187385U JPS61179770U (en) 1985-04-26 1985-04-26

Publications (1)

Publication Number Publication Date
JPS61179770U true JPS61179770U (en) 1986-11-10

Family

ID=30590554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6187385U Pending JPS61179770U (en) 1985-04-26 1985-04-26

Country Status (1)

Country Link
JP (1) JPS61179770U (en)

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