JPS6274364U - - Google Patents
Info
- Publication number
- JPS6274364U JPS6274364U JP16607185U JP16607185U JPS6274364U JP S6274364 U JPS6274364 U JP S6274364U JP 16607185 U JP16607185 U JP 16607185U JP 16607185 U JP16607185 U JP 16607185U JP S6274364 U JPS6274364 U JP S6274364U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- land
- lands
- connection
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図イは本考案の一実施例に係る接続用回路
パターンの平面図、第１図ロは本考案の他の実施
例に係る接続用回路パターンの平面図、第２図は
第１図イ，ロに示す接続用回路パターンを用いて
アース接続を行つた状態の断面図、第３図イは従
来の接続用回路パターンの平面図、第３図ロは上
記従来の接続用回路パターンをプリント基板に実
装した状態の側面図、第３図ハは第３図ロに示す
接続用回路パターンのランドにはんだ上げを行つ
た状態の側面図、第４図は第３図イの接続用回路
パターンを用いてアース接続を行つた状態の断面
図である。
１：ランド、２：プリント基板、３，４：はん
だ、５：ねじ、６：アース部、７：パターン部、
８：ランド、９：パツド、１０：接続パターン、
１１，１２，１３：円形ランド、１４，１６：隙
間、１５：はんだ。
FIG. 1A is a plan view of a connection circuit pattern according to an embodiment of the present invention, FIG. 1B is a plan view of a connection circuit pattern according to another embodiment of the present invention, and FIG. Figure 3A is a plan view of the conventional connection circuit pattern, and Figure 3B is the above conventional connection circuit pattern. Figure 3C is a side view of the circuit board mounted on the printed circuit board, Figure 3C is a side view of the connection circuit pattern shown in Figure 3B with solder applied to the land, Figure 4 is the connection circuit of Figure 3A. FIG. 3 is a cross-sectional view of a state in which a pattern is used to make a ground connection. 1: Land, 2: Printed circuit board, 3, 4: Solder, 5: Screw, 6: Ground section, 7: Pattern section,
8: Land, 9: Padded, 10: Connection pattern,
11, 12, 13: circular land, 14, 16: gap, 15: solder.
Claims (1)
ランドのまわりに互いに接続された数個のパツト
又は、細い円形のランドを設けた構造を有し、は
んだ上げ後に前記ランドのねじ締め接続を有利に
したことを特徴とする接続用回路パターン。 In the circuit pattern for connecting printed circuit boards,
1. A circuit pattern for connection, characterized in that it has a structure in which several patches or thin circular lands connected to each other are provided around a land, making it advantageous to connect the lands with screws after soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16607185U JPS6274364U (en) | 1985-10-29 | 1985-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16607185U JPS6274364U (en) | 1985-10-29 | 1985-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6274364U true JPS6274364U (en) | 1987-05-13 |
Family
ID=31096692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16607185U Pending JPS6274364U (en) | 1985-10-29 | 1985-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6274364U (en) |
-
1985
- 1985-10-29 JP JP16607185U patent/JPS6274364U/ja active Pending