JPS61114878U - - Google Patents
Info
- Publication number
- JPS61114878U JPS61114878U JP19785784U JP19785784U JPS61114878U JP S61114878 U JPS61114878 U JP S61114878U JP 19785784 U JP19785784 U JP 19785784U JP 19785784 U JP19785784 U JP 19785784U JP S61114878 U JPS61114878 U JP S61114878U
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- hole
- rigid
- insulating layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 10
- 230000000149 penetrating effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案のフレキシブル基板の接続装置
の一実施例を示す平面図、第２図は第１図の縦断
面図、第３図は従来のフレキシブル基板の接続装
置を示す平面図、第４図は第３図の縦断面図、第
５図は従来の他のフレキシブル基板の接続装置を
示す平面図、第６図は第５図の縦断面図である。
１０……フレキシブル基板、１０ａ……可撓性
絶縁層、１０ｂ，１１ｂ……導体パターン、１０
ｃ……フレキシブル基板側貫通孔、１１……リジ
ツド基板、１１ａ……絶縁層、１１ｃ……リジツ
ド基板側貫通孔。
FIG. 1 is a plan view showing an embodiment of the flexible board connection device of the present invention, FIG. 2 is a vertical sectional view of FIG. 1, and FIG. 3 is a plan view showing a conventional flexible board connection device. 4 is a longitudinal sectional view of FIG. 3, FIG. 5 is a plan view showing another conventional flexible board connection device, and FIG. 6 is a longitudinal sectional view of FIG. 5. 10... Flexible board, 10a... Flexible insulating layer, 10b, 11b... Conductor pattern, 10
c...Flexible board side through hole, 11...Rigid board, 11a...Insulating layer, 11c...Rigid board side through hole.
Claims (1)
板上に、可撓性絶縁層上に導体パターンを形成し
たフレキシブル基板を搭載させて、前記リジツド
基板の導体パターンと前記フレキシブル基板の導
体パターンとを半田付けしたフレキシブル基板の
接続装置において、前記リジツド基板の導体パタ
ーンと絶縁層とを貫通してリジツド基板側貫通孔
を穿設する一方、前記フレキシブル基板の導体パ
ターンと可撓性絶縁層とを貫通してフレキシブル
基板側貫通孔を穿設し、前記リジツド基板側貫通
孔と前記フレキシブル基板側貫通孔とを連通する
ように重ね合せ、前記フレキシブル基板側貫通孔
から半田を流し込み前記リジツド基板と前記フレ
キシブル基板とを接続したことを特徴とするフレ
キシブル基板の接続装置。 A flexible substrate having a conductive pattern formed on a flexible insulating layer is mounted on a rigid substrate having a conductive pattern formed on an insulating layer, and the conductive pattern of the rigid substrate and the conductive pattern of the flexible substrate are soldered. In the flexible board connection device, a through hole is formed on the rigid board side by penetrating the conductor pattern and the insulating layer of the rigid board, and at the same time, by penetrating the conductor pattern and the flexible insulating layer of the flexible board. A through hole on the flexible substrate side is bored, the through hole on the rigid substrate side and the through hole on the flexible substrate side are overlapped so as to communicate with each other, and solder is poured through the through hole on the flexible substrate side to connect the rigid substrate and the flexible substrate. A flexible board connection device characterized by connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19785784U JPS61114878U (en) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19785784U JPS61114878U (en) | 1984-12-28 | 1984-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61114878U true JPS61114878U (en) | 1986-07-19 |
Family
ID=30756375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19785784U Pending JPS61114878U (en) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61114878U (en) |
-
1984
- 1984-12-28 JP JP19785784U patent/JPS61114878U/ja active Pending