JPH0350400U - - Google Patents
Info
- Publication number
- JPH0350400U JPH0350400U JP11187289U JP11187289U JPH0350400U JP H0350400 U JPH0350400 U JP H0350400U JP 11187289 U JP11187289 U JP 11187289U JP 11187289 U JP11187289 U JP 11187289U JP H0350400 U JPH0350400 U JP H0350400U
- Authority
- JP
- Japan
- Prior art keywords
- mask
- effective width
- landing
- view
- pattern hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図は本考案の実施例を示すものであつて、第１
図はスクリーンマスクの平面図、第２図はペース
ト半田を塗布した状態の平面図、第３図は電子部
品を搭載した状態の斜視図、第４図はリフロー後
の平面図、第５図は他の実施例のパターン孔の平
面図、第６図は更に他の実施例のパターン孔の平
面図、第７図はリードを着地させた状態の斜視図
、第８図及び第９図は従来手段の斜視図及び平面
図である。
１……スクリーンマスク、３……マスク、４，
１４，１５，１６……パターン孔、ｄ……有効巾
。
The figure shows an embodiment of the present invention.
The figure is a plan view of the screen mask, Fig. 2 is a plan view with paste solder applied, Fig. 3 is a perspective view with electronic components mounted, Fig. 4 is a plan view after reflow, and Fig. 5 is a plan view of the screen mask. FIG. 6 is a plan view of a pattern hole of another embodiment, FIG. 7 is a perspective view of a state in which the lead has landed, and FIGS. 8 and 9 are conventional FIG. 3 is a perspective view and a plan view of the means. 1...Screen mask, 3...Mask, 4,
14, 15, 16...pattern hole, d...effective width.
Claims (1)
極部の着地部に対応する部分の有効巾を、非着地
部に対応する部分の有効巾よりも小さくしたこと
を特徴とするペースト半田の塗布用スクリーンマ
スク。 A screen for applying solder paste, characterized in that the effective width of the part of the pattern hole formed in the mask corresponding to the landing part of the electrode part of the electronic component is smaller than the effective width of the part corresponding to the non-landing part. mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11187289U JPH0350400U (en) | 1989-09-25 | 1989-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11187289U JPH0350400U (en) | 1989-09-25 | 1989-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350400U true JPH0350400U (en) | 1991-05-16 |
Family
ID=31660334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11187289U Pending JPH0350400U (en) | 1989-09-25 | 1989-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350400U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007203006A (en) * | 2006-02-02 | 2007-08-16 | Michio Hayashi | Tie clip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169394A (en) * | 1980-05-31 | 1981-12-26 | Matsushita Electric Works Ltd | Method of mounting electronic part on printed board |
| JPS6461091A (en) * | 1987-09-01 | 1989-03-08 | Mitsubishi Electric Corp | Method of mounting electronic component |
-
1989
- 1989-09-25 JP JP11187289U patent/JPH0350400U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169394A (en) * | 1980-05-31 | 1981-12-26 | Matsushita Electric Works Ltd | Method of mounting electronic part on printed board |
| JPS6461091A (en) * | 1987-09-01 | 1989-03-08 | Mitsubishi Electric Corp | Method of mounting electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007203006A (en) * | 2006-02-02 | 2007-08-16 | Michio Hayashi | Tie clip |