JPH01107175U - - Google Patents
Info
- Publication number
- JPH01107175U JPH01107175U JP126088U JP126088U JPH01107175U JP H01107175 U JPH01107175 U JP H01107175U JP 126088 U JP126088 U JP 126088U JP 126088 U JP126088 U JP 126088U JP H01107175 U JPH01107175 U JP H01107175U
- Authority
- JP
- Japan
- Prior art keywords
- lands
- screen
- solder
- small
- small area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案に係るクリーム半田印刷装置
の一実施例を説明する斜視図、第２図は第１図の
装置によつてクリーム半田を塗布する工程を説明
する工程図、第３図はリフロー半田付け法を説明
する説明図、第４図は従来のクリーム半田印刷装
置を説明する斜視図、第５図は従来の塗布工程を
示す工程図である。
１１…印刷配線板、１２…第１のスクリーン、
１３…第２のスクリーン、１４…スキージ、１５
，１６…半田付けランド、１７，１８…半田塗布
孔、１９…凹欠。
FIG. 1 is a perspective view illustrating an embodiment of the cream solder printing device according to this invention, FIG. 2 is a process diagram illustrating the process of applying cream solder using the device shown in FIG. 1, and FIG. FIG. 4 is a perspective view illustrating a conventional cream solder printing device, and FIG. 5 is a process diagram illustrating a conventional coating process. 11...Printed wiring board, 12...First screen,
13...Second screen, 14...Squeegee, 15
, 16... Soldering land, 17, 18... Solder application hole, 19... Notch.
Claims (1)
付けランドのうち面積の小さいランドに対応する
半田塗布孔を形成した第１のスクリーンと、 この第１のスクリーンの厚みより厚く形成し、
上記面積の小さいランドに対応した半田塗布孔と
ほぼ同じ大きさの半田塗布孔を面積の大きいラン
ドに対応して設けて成る第２のスクリーンとを具
備し、これら第１、第２のスクリーンを用いて印
刷配線板にクリーム半田を印刷するようにしたこ
とを特徴とするクリーム半田印刷装置。[Claim for Utility Model Registration] A first screen having a plurality of large and small soldering lands and forming solder application holes corresponding to the lands with a small area among these soldering lands, and the thickness of this first screen. form thicker,
a second screen having solder coating holes of approximately the same size as the solder coating holes corresponding to the lands with a small area, corresponding to the lands with a large area; A cream solder printing device characterized in that it is used to print cream solder on a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP126088U JPH01107175U (en) | 1988-01-11 | 1988-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP126088U JPH01107175U (en) | 1988-01-11 | 1988-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107175U true JPH01107175U (en) | 1989-07-19 |
Family
ID=31200997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP126088U Pending JPH01107175U (en) | 1988-01-11 | 1988-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100318498B1 (en) * | 1999-09-07 | 2001-12-22 | 김춘호 | Jig for side printing of a chip element |
-
1988
- 1988-01-11 JP JP126088U patent/JPH01107175U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100318498B1 (en) * | 1999-09-07 | 2001-12-22 | 김춘호 | Jig for side printing of a chip element |