JPH0331973U - - Google Patents
Info
- Publication number
- JPH0331973U JPH0331973U JP9203989U JP9203989U JPH0331973U JP H0331973 U JPH0331973 U JP H0331973U JP 9203989 U JP9203989 U JP 9203989U JP 9203989 U JP9203989 U JP 9203989U JP H0331973 U JPH0331973 U JP H0331973U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- holes
- printed board
- screen
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案の第１実施例のスクリーン板
の平面図。第２図は第１図のＡ−Ａ線断面図。第
３図及び第４図は、本考案の第２及び第３実施例
のスクリーン板の平面図。第５図は、一般的な電
子部品の実装状態図。第６図は、クリームはんだ
の塗布作業図。第７図は、従来のクリームはんだ
の塗布状態図。
１はプリント板、２はランド部、４１はクリー
ムはんだ、５はスクリーン板、５３は複合透孔、
５４は小孔。
FIG. 1 is a plan view of a screen plate according to a first embodiment of the present invention. FIG. 2 is a sectional view taken along the line A-A in FIG. 1. 3 and 4 are plan views of screen plates according to second and third embodiments of the present invention. FIG. 5 is a diagram showing the mounting state of general electronic components. Figure 6 is a diagram of the cream solder application process. FIG. 7 is a diagram showing the state of application of conventional cream solder. 1 is a printed board, 2 is a land portion, 41 is cream solder, 5 is a screen board, 53 is a composite through hole,
54 is a small hole.
Claims (1)
ランド部上にクリームはんだを印刷塗布する透孔
を多数備えたスクリーン板において、 前記各ランド部に対応する各透孔を、複数個の
小孔の集合からなる複合透孔に形成したことを特
徴とするクリームはんだ塗布用スクリーン板。[Claims for Utility Model Registration] In a screen board that is placed on a printed board and has a number of through holes for printing and applying cream solder onto each land portion of the printed board, each of the through holes corresponding to each of the land portions A screen plate for applying cream solder, characterized in that the hole is formed into a composite hole consisting of a set of a plurality of small holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9203989U JPH0331973U (en) | 1989-08-04 | 1989-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9203989U JPH0331973U (en) | 1989-08-04 | 1989-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0331973U true JPH0331973U (en) | 1991-03-28 |
Family
ID=31641486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9203989U Pending JPH0331973U (en) | 1989-08-04 | 1989-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0331973U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01224160A (en) * | 1988-02-29 | 1989-09-07 | Mitsubishi Electric Corp | Solder mask |
| JPH0281689A (en) * | 1988-09-19 | 1990-03-22 | Tamura Seisakusho Co Ltd | Screen mask for cream solder printing |
| JPH0212868B2 (en) * | 1985-11-25 | 1990-03-28 | Sumitomo Electric Industries |
-
1989
- 1989-08-04 JP JP9203989U patent/JPH0331973U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0212868B2 (en) * | 1985-11-25 | 1990-03-28 | Sumitomo Electric Industries | |
| JPH01224160A (en) * | 1988-02-29 | 1989-09-07 | Mitsubishi Electric Corp | Solder mask |
| JPH0281689A (en) * | 1988-09-19 | 1990-03-22 | Tamura Seisakusho Co Ltd | Screen mask for cream solder printing |