JPH02127064U - - Google Patents
Info
- Publication number
- JPH02127064U JPH02127064U JP3601889U JP3601889U JPH02127064U JP H02127064 U JPH02127064 U JP H02127064U JP 3601889 U JP3601889 U JP 3601889U JP 3601889 U JP3601889 U JP 3601889U JP H02127064 U JPH02127064 U JP H02127064U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lands
- conductive patterns
- printed circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図はこの考案の一実施例を示す平面図、第
２図はこの考案の他の実施例を示す平面図、第３
図はこの考案のさらに他の実施例を示す平面図、
第４図は従来の回路基板を示す平面図である。
なお、６は印刷基板、７は導通パターン、８は
ランドＡ、９はランドＢ、１２はチツプ形回路部
品である。
Fig. 1 is a plan view showing one embodiment of this invention, Fig. 2 is a plan view showing another embodiment of this invention, and Fig. 3 is a plan view showing another embodiment of this invention.
The figure is a plan view showing still another embodiment of this invention.
FIG. 4 is a plan view showing a conventional circuit board. Note that 6 is a printed circuit board, 7 is a conductive pattern, 8 is a land A, 9 is a land B, and 12 is a chip-shaped circuit component.
Claims (1)
された複数の導通パターンと、この複数の導通パ
ターンにそれぞれ設けられたランドと、このラン
ドにまたがるように実装されたチツプ形回路部品
とを備え、上記ランドの各面積が全て等しく形成
されたことを特徴とする回路基板。 The device includes a printed circuit board, a plurality of conductive patterns disposed internally to face the printed circuit board, lands provided on each of the plurality of conductive patterns, and a chip-shaped circuit component mounted across the lands. . A circuit board characterized in that the lands have the same area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3601889U JPH02127064U (en) | 1989-03-29 | 1989-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3601889U JPH02127064U (en) | 1989-03-29 | 1989-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127064U true JPH02127064U (en) | 1990-10-19 |
Family
ID=31541882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3601889U Pending JPH02127064U (en) | 1989-03-29 | 1989-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127064U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013132542A1 (en) * | 2012-03-09 | 2013-09-12 | 三菱電機株式会社 | Printed circuit board and electronic apparatus |
| JP2013251493A (en) * | 2012-06-04 | 2013-12-12 | Toshiba Corp | Element module |
-
1989
- 1989-03-29 JP JP3601889U patent/JPH02127064U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013132542A1 (en) * | 2012-03-09 | 2013-09-12 | 三菱電機株式会社 | Printed circuit board and electronic apparatus |
| JP2013251493A (en) * | 2012-06-04 | 2013-12-12 | Toshiba Corp | Element module |