JPH0385683U - - Google Patents
Info
- Publication number
- JPH0385683U JPH0385683U JP14749089U JP14749089U JPH0385683U JP H0385683 U JPH0385683 U JP H0385683U JP 14749089 U JP14749089 U JP 14749089U JP 14749089 U JP14749089 U JP 14749089U JP H0385683 U JPH0385683 U JP H0385683U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- parts
- soldering parts
- mutual interval
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント基板の概要を説明す
るための一部省略平面図、第２図乃至第４図はそ
れぞれ本考案の他の実施例を示す要部平面図、第
５図は従来例を示す一部省略平面図、第６図は同
プリント基板のハンダ付け工程を説明するための
一部省略側断面図、第７図は同プリント基板のハ
ンダ付け後の状態を示す要部側断面図である。
１……プリント基板、３……第１のハンダ付け
部、５……第２のハンダ付け部、１１……透孔。
Fig. 1 is a partially omitted plan view for explaining the outline of the printed circuit board of the present invention, Figs. 2 to 4 are plan views of main parts showing other embodiments of the present invention, and Fig. 5 is a conventional one. A partially omitted plan view showing an example, Fig. 6 is a partially omitted side sectional view to explain the soldering process of the same printed circuit board, and Fig. 7 is a main part side showing the state of the same printed circuit board after soldering. FIG. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 3... First soldering part, 5... Second soldering part, 11... Through hole.
Claims (1)
ダ付け部と、前記第１のハンダ付け部それぞれに
近接して設けた第２のハンダ付け部とを備え、同
第２のハンダ付け部と前記第１のハンダ付け部と
の相互間隔が、同複数の第１のハンダ付け部間の
相互間隔より狭いことを特徴とするプリント基板
。 A plurality of first soldering parts having through holes and spaced apart from each other, and a second soldering part provided close to each of the first soldering parts, A printed circuit board characterized in that a mutual interval between the plurality of soldering parts and the first soldering part is narrower than a mutual interval between the plurality of first soldering parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14749089U JPH0385683U (en) | 1989-12-20 | 1989-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14749089U JPH0385683U (en) | 1989-12-20 | 1989-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385683U true JPH0385683U (en) | 1991-08-29 |
Family
ID=31693999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14749089U Pending JPH0385683U (en) | 1989-12-20 | 1989-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385683U (en) |
-
1989
- 1989-12-20 JP JP14749089U patent/JPH0385683U/ja active Pending