JPH0396065U - - Google Patents
Info
- Publication number
- JPH0396065U JPH0396065U JP350090U JP350090U JPH0396065U JP H0396065 U JPH0396065 U JP H0396065U JP 350090 U JP350090 U JP 350090U JP 350090 U JP350090 U JP 350090U JP H0396065 U JPH0396065 U JP H0396065U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- hole
- hybrid integrated
- center line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂは本考案に関わる混成集積回路基
板の実施例を示す平面図、第２図は同実施例にお
けるＣ−Ｃ線断面図斜視図、第３図ａ，ｂは従来
の混成集積回路基板を示す平面図である。
２……分割基板、３ａ，３ｂ……混成集積回路
パターン、８ａ，８ｂ……半円スルーホール、９
……切欠溝、２０……混成集積回路基板、２１…
…中心切欠溝。
1A and 1B are plan views showing an embodiment of a hybrid integrated circuit board related to the present invention, FIG. FIG. 2 is a plan view showing an integrated circuit board. 2... Divided board, 3a, 3b... Hybrid integrated circuit pattern, 8a, 8b... Semicircular through hole, 9
... Notch groove, 20 ... Hybrid integrated circuit board, 21 ...
...Central notch groove.
Claims (1)
板両面の電気的接続を行うように構成されたスル
ーホールが設けられた混成集積回路基板において
、前記切欠溝に囲繞される少なくとも一組の切欠
基板を切欠中心線を境に線対称となるように構成
するとともに該切欠中心線上にスルーホールを設
けたことを特徴とする混成集積回路基板。 In a hybrid integrated circuit board that is divided into a plurality of pieces along a cutout groove and provided with through holes configured to electrically connect both sides of the board, at least one set of cutout boards surrounded by the cutout groove. What is claimed is: 1. A hybrid integrated circuit board characterized in that a through hole is provided on the notch center line, and a through hole is provided on the notch center line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP350090U JPH0396065U (en) | 1990-01-18 | 1990-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP350090U JPH0396065U (en) | 1990-01-18 | 1990-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396065U true JPH0396065U (en) | 1991-10-01 |
Family
ID=31507319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP350090U Pending JPH0396065U (en) | 1990-01-18 | 1990-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396065U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353574A (en) * | 2001-05-28 | 2002-12-06 | Kyocera Corp | Multiple allocation substrate for mounting electronic component |
| JP2004047759A (en) * | 2002-07-12 | 2004-02-12 | Alps Electric Co Ltd | Aggregate substrate of electronic unit |
| KR100720903B1 (en) * | 2006-04-18 | 2007-05-23 | 주식회사 엔텍 | A bathtub |
-
1990
- 1990-01-18 JP JP350090U patent/JPH0396065U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353574A (en) * | 2001-05-28 | 2002-12-06 | Kyocera Corp | Multiple allocation substrate for mounting electronic component |
| JP4666812B2 (en) * | 2001-05-28 | 2011-04-06 | 京セラ株式会社 | Board for mounting electronic components |
| JP2004047759A (en) * | 2002-07-12 | 2004-02-12 | Alps Electric Co Ltd | Aggregate substrate of electronic unit |
| KR100720903B1 (en) * | 2006-04-18 | 2007-05-23 | 주식회사 엔텍 | A bathtub |