JPH0258368U - - Google Patents

Info

Publication number
JPH0258368U
JPH0258368U JP13678788U JP13678788U JPH0258368U JP H0258368 U JPH0258368 U JP H0258368U JP 13678788 U JP13678788 U JP 13678788U JP 13678788 U JP13678788 U JP 13678788U JP H0258368 U JPH0258368 U JP H0258368U
Authority
JP
Japan
Prior art keywords
wide
surface pattern
soldered
electrodes
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13678788U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13678788U priority Critical patent/JPH0258368U/ja
Publication of JPH0258368U publication Critical patent/JPH0258368U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による広面パターンの一実施例
を部品取付け前の状態で示す斜視図、第2図はそ
の部品を取付けた後の状態を示す断面図である。
FIG. 1 is a perspective view showing an embodiment of the wide-surface pattern according to the present invention before parts are attached, and FIG. 2 is a sectional view showing the state after the parts are attached.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基板上に形成され、電極が半田付けされる
広面パターンにおいて、広面パターンの外周近傍
に凹部を設けたことを特徴とする広面パターン。
1. A wide-surface pattern formed on a metal substrate to which electrodes are soldered, characterized in that a recess is provided near the outer periphery of the wide-surface pattern.
JP13678788U 1988-10-19 1988-10-19 Pending JPH0258368U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13678788U JPH0258368U (en) 1988-10-19 1988-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13678788U JPH0258368U (en) 1988-10-19 1988-10-19

Publications (1)

Publication Number Publication Date
JPH0258368U true JPH0258368U (en) 1990-04-26

Family

ID=31397620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13678788U Pending JPH0258368U (en) 1988-10-19 1988-10-19

Country Status (1)

Country Link
JP (1) JPH0258368U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114587A (en) * 2004-10-13 2006-04-27 Tohoku Ricoh Co Ltd Printed circuit board
JP2009231597A (en) * 2008-03-24 2009-10-08 Fujitsu Ltd Electronic device
WO2014061483A1 (en) * 2012-10-17 2014-04-24 株式会社デノヴ Conductive pattern member and method for manufacturing conductive pattern member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114587A (en) * 2004-10-13 2006-04-27 Tohoku Ricoh Co Ltd Printed circuit board
JP2009231597A (en) * 2008-03-24 2009-10-08 Fujitsu Ltd Electronic device
WO2014061483A1 (en) * 2012-10-17 2014-04-24 株式会社デノヴ Conductive pattern member and method for manufacturing conductive pattern member

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