JPH0258368U - - Google Patents
Info
- Publication number
- JPH0258368U JPH0258368U JP13678788U JP13678788U JPH0258368U JP H0258368 U JPH0258368 U JP H0258368U JP 13678788 U JP13678788 U JP 13678788U JP 13678788 U JP13678788 U JP 13678788U JP H0258368 U JPH0258368 U JP H0258368U
- Authority
- JP
- Japan
- Prior art keywords
- wide
- surface pattern
- soldered
- electrodes
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第1図は本考案による広面パターンの一実施例
を部品取付け前の状態で示す斜視図、第2図はそ
の部品を取付けた後の状態を示す断面図である。
FIG. 1 is a perspective view showing an embodiment of the wide-surface pattern according to the present invention before parts are attached, and FIG. 2 is a sectional view showing the state after the parts are attached.
Claims (1)
広面パターンにおいて、広面パターンの外周近傍
に凹部を設けたことを特徴とする広面パターン。 1. A wide-surface pattern formed on a metal substrate to which electrodes are soldered, characterized in that a recess is provided near the outer periphery of the wide-surface pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13678788U JPH0258368U (en) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13678788U JPH0258368U (en) | 1988-10-19 | 1988-10-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0258368U true JPH0258368U (en) | 1990-04-26 |
Family
ID=31397620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13678788U Pending JPH0258368U (en) | 1988-10-19 | 1988-10-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0258368U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006114587A (en) * | 2004-10-13 | 2006-04-27 | Tohoku Ricoh Co Ltd | Printed circuit board |
JP2009231597A (en) * | 2008-03-24 | 2009-10-08 | Fujitsu Ltd | Electronic device |
WO2014061483A1 (en) * | 2012-10-17 | 2014-04-24 | 株式会社デノヴ | Conductive pattern member and method for manufacturing conductive pattern member |
-
1988
- 1988-10-19 JP JP13678788U patent/JPH0258368U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006114587A (en) * | 2004-10-13 | 2006-04-27 | Tohoku Ricoh Co Ltd | Printed circuit board |
JP2009231597A (en) * | 2008-03-24 | 2009-10-08 | Fujitsu Ltd | Electronic device |
WO2014061483A1 (en) * | 2012-10-17 | 2014-04-24 | 株式会社デノヴ | Conductive pattern member and method for manufacturing conductive pattern member |