JPH0471275U - - Google Patents
Info
- Publication number
- JPH0471275U JPH0471275U JP11408090U JP11408090U JPH0471275U JP H0471275 U JPH0471275 U JP H0471275U JP 11408090 U JP11408090 U JP 11408090U JP 11408090 U JP11408090 U JP 11408090U JP H0471275 U JPH0471275 U JP H0471275U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- printed
- metal mask
- printing
- mount pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
Description
第１図はこの考案に係わるメタルマスクの開口
部穴の形状を示す説明図、第２図はリフローはん
だ後の状態を示す側面図、第３図は従来の方法を
示す説明図で、第３図ＡはＦＰＩＣと基板との関
係を示す側面図、第３図ＢはＦＰＩＣリードに対
する基板のマウントパツド図、第３図Ｃはマウン
トパツドに対応する従来のメタルマスクの開口部
穴図面、第４図は基板上にクリームはんだを印刷
塗布してＦＰＩＣを搭載した状態を示す側面図、
第５図は従来のリフローソルダリング後の状態を
示す側面図、第６図はＦＰＩＣのリードとクリー
ムはんだの塗布との関係の説明図である。
１……メタルマスクの開口部穴、２……フラツ
トパツケージタイプＩＣのリード、３……マウン
トパツド、４……はんだ付け部、５……フイレツ
ト、６……基板、７……フラツトパツケージタイ
プＩＣ、８……リード、９……クリームはんだ。
Fig. 1 is an explanatory diagram showing the shape of the opening hole of the metal mask related to this invention, Fig. 2 is a side view showing the state after reflow soldering, and Fig. 3 is an explanatory diagram showing the conventional method. Figure A is a side view showing the relationship between the FPIC and the board, Figure 3B is a diagram of the mounting pad of the board for the FPIC lead, Figure 3C is a diagram of the opening hole of a conventional metal mask corresponding to the mounting pad, and Figure 4 is A side view showing a state in which cream solder is printed and applied on a board and an FPIC is mounted.
FIG. 5 is a side view showing the state after conventional reflow soldering, and FIG. 6 is an explanatory diagram of the relationship between the FPIC leads and the application of cream solder. 1... Opening hole of metal mask, 2... Lead of flat package type IC, 3... Mount pad, 4... Soldering part, 5... Fillet, 6... Board, 7... Flat package type. IC, 8...Lead, 9...Cream solder.
Claims (1)
ームはんだを印刷塗布するさいに、ＩＣのリード
先端部周辺にのみ、クリームはんだを増量印刷塗
布可能な穴構造を開口部に具備してなるスクリー
ン印刷用メタルマスク。 This metal mask for screen printing has a hole structure in its opening that allows an increased amount of cream solder to be printed and applied only around the lead tips of an IC when printing and applying cream solder to an IC mount pad on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11408090U JPH0471275U (en) | 1990-11-01 | 1990-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11408090U JPH0471275U (en) | 1990-11-01 | 1990-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0471275U true JPH0471275U (en) | 1992-06-24 |
Family
ID=31861730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11408090U Pending JPH0471275U (en) | 1990-11-01 | 1990-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0471275U (en) |
-
1990
- 1990-11-01 JP JP11408090U patent/JPH0471275U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0323965U (en) | ||
| JPH0471275U (en) | ||
| JPS6384978U (en) | ||
| JPH034065U (en) | ||
| JPH0217854U (en) | ||
| JPH0481763U (en) | ||
| JPH0286175U (en) | ||
| JPS61136576U (en) | ||
| JPH0350400U (en) | ||
| JPS59195767U (en) | Pattern shape of printed wiring board | |
| JPS6018575U (en) | printed circuit board equipment | |
| JPH0356120U (en) | ||
| JPH02116748U (en) | ||
| JPH0281026U (en) | ||
| JPH0385682U (en) | ||
| JPS645476U (en) | ||
| JPH0262736U (en) | ||
| JPH02127052U (en) | ||
| JPH0350370U (en) | ||
| JPH0325279U (en) | ||
| JPS63136352U (en) | ||
| JPS63133873U (en) | ||
| JPH0455162U (en) | ||
| JPH0430760U (en) | ||
| JPS6452275U (en) |