JPS63201377U - - Google Patents
Info
- Publication number
- JPS63201377U JPS63201377U JP9354487U JP9354487U JPS63201377U JP S63201377 U JPS63201377 U JP S63201377U JP 9354487 U JP9354487 U JP 9354487U JP 9354487 U JP9354487 U JP 9354487U JP S63201377 U JPS63201377 U JP S63201377U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder resist
- photosensitive solder
- character printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図及び第２図は、本考案の感光性ソルダー
・レジストを有するプリント配線板の断面図、第
３図及び第４図は従来の、感光性ソルダー・レジ
ストを有するプリント配線板の断面図である。
１……表面実装部品固定用パツド、２……文字
印刷用インク、３……感光性ソルダー・レジスト
、４……スルー・ホール・メツキ壁、５……プリ
ント板基材、６……表面実装部品リード、７……
半田、８……表面実装部品、９……裏面回路パタ
ーン。
1 and 2 are cross-sectional views of a printed wiring board having a photosensitive solder resist according to the present invention, and FIGS. 3 and 4 are cross-sectional views of a conventional printed wiring board having a photosensitive solder resist. It is. 1... Pad for fixing surface mount components, 2... Ink for character printing, 3... Photosensitive solder resist, 4... Through hole plating wall, 5... Printed board base material, 6... Surface mounting Parts lead, 7...
Solder, 8...Surface mount component, 9...Back side circuit pattern.
Claims (1)
線板において、感光性ソルダー・レジストで、レ
ジスト・パターンを形成後、文字印刷インクを、
文字印刷と同時にヴイア・ホール（部品を塔載し
ないスルー・ホール）に、塗布したことを特徴と
するプリント配線板。 In a printed wiring board having a photosensitive solder resist, after forming a resist pattern with the photosensitive solder resist, character printing ink is applied.
A printed wiring board characterized by coating the via holes (through holes where no parts are mounted) at the same time as character printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9354487U JPS63201377U (en) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9354487U JPS63201377U (en) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201377U true JPS63201377U (en) | 1988-12-26 |
Family
ID=30956207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9354487U Pending JPS63201377U (en) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201377U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621283U (en) * | 1992-06-25 | 1994-03-18 | 富士通テン株式会社 | Printed wiring board |
-
1987
- 1987-06-17 JP JP9354487U patent/JPS63201377U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621283U (en) * | 1992-06-25 | 1994-03-18 | 富士通テン株式会社 | Printed wiring board |