JPH0436271U - - Google Patents
Info
- Publication number
- JPH0436271U JPH0436271U JP7827290U JP7827290U JPH0436271U JP H0436271 U JPH0436271 U JP H0436271U JP 7827290 U JP7827290 U JP 7827290U JP 7827290 U JP7827290 U JP 7827290U JP H0436271 U JPH0436271 U JP H0436271U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- circuit testing
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａは本考案の一実施例の斜視図、第１図
ｂは第１図ａのＡ−Ａ′線における断面図、第２
図ａは従来の印刷配線板の一例の斜視図、第２図
ｂは第２図ａのＢ−Ｂ′線における断面図である
。
１，５……印刷配線板、２……表面実装部品の
取付ランド（パツド）、３，３′……インサーキ
ツトテスト用の穴、４……シルク印刷。
Fig. 1a is a perspective view of one embodiment of the present invention, Fig. 1b is a sectional view taken along line A-A' in Fig. 1a, and Fig. 2 is a perspective view of an embodiment of the present invention.
Fig. 2a is a perspective view of an example of a conventional printed wiring board, and Fig. 2b is a sectional view taken along line BB' in Fig. 2a. 1, 5...Printed wiring board, 2...Mounting land (pad) for surface mount components, 3, 3'...Hole for insert circuit test, 4...Silk printing.
Claims (1)
記表面実装部品を取付けるランド内にわずかに入
り込む状態で穿設されインサーキツトテスト用の
穴と、この穴のインサーキツトテスト用プローブ
が接触する面と反対側の面に施されて該穴を埋め
るように被さるシルク印刷とを備えることを特徴
とする印刷配線板。 In a printed wiring board for mounting surface mount components, there is a hole for in-circuit testing that is drilled slightly into the land on which the surface mount component is mounted, and a surface opposite to the surface of this hole where the probe for in-circuit testing comes into contact. 1. A printed wiring board comprising: silk printing applied to a side surface and covering the hole so as to fill the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7827290U JPH0436271U (en) | 1990-07-24 | 1990-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7827290U JPH0436271U (en) | 1990-07-24 | 1990-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436271U true JPH0436271U (en) | 1992-03-26 |
Family
ID=31621398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7827290U Pending JPH0436271U (en) | 1990-07-24 | 1990-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436271U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09331145A (en) * | 1996-06-11 | 1997-12-22 | Nec Corp | Pad structure on wiring board |
| JP2017175807A (en) * | 2016-03-24 | 2017-09-28 | サンデン・オートモーティブコンポーネント株式会社 | Electronic circuit device and inverter built-in motor compressor having the same |
-
1990
- 1990-07-24 JP JP7827290U patent/JPH0436271U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09331145A (en) * | 1996-06-11 | 1997-12-22 | Nec Corp | Pad structure on wiring board |
| JP2017175807A (en) * | 2016-03-24 | 2017-09-28 | サンデン・オートモーティブコンポーネント株式会社 | Electronic circuit device and inverter built-in motor compressor having the same |