JPH0275765U - - Google Patents
Info
- Publication number
- JPH0275765U JPH0275765U JP15571088U JP15571088U JPH0275765U JP H0275765 U JPH0275765 U JP H0275765U JP 15571088 U JP15571088 U JP 15571088U JP 15571088 U JP15571088 U JP 15571088U JP H0275765 U JPH0275765 U JP H0275765U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- groove
- printed
- broken
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
従来の印刷配線基板の斜視図である。
１……プリント基板、２，３……プリント板表
面、４，５……Ｖ溝、６……Ｖ溝の残り部分、７
……貫通孔。
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional printed wiring board. 1... Printed board, 2, 3... Printed board surface, 4, 5... V groove, 6... Remaining part of V groove, 7
...through hole.
Claims (1)
とができるチヨコブレーク用のＶ溝を前記プリン
ト基板の両面または片面に設けた印刷配線基板に
おいて、前記Ｖ溝の任意の箇所に複数個の貫通孔
を設けたことを特徴とする印刷配線基板。 A printed circuit board in which a V-groove for a horizontal break that can be broken off after mounting components on the printed circuit board is provided on both sides or one side of the printed circuit board, and a plurality of through holes are provided at arbitrary locations in the V-groove. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15571088U JPH0275765U (en) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15571088U JPH0275765U (en) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275765U true JPH0275765U (en) | 1990-06-11 |
Family
ID=31433584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15571088U Pending JPH0275765U (en) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275765U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013157432A (en) * | 2012-01-30 | 2013-08-15 | Seiko Epson Corp | Substrate assembly, electronic device, and manufacturing method of substrate assembly |
-
1988
- 1988-11-29 JP JP15571088U patent/JPH0275765U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013157432A (en) * | 2012-01-30 | 2013-08-15 | Seiko Epson Corp | Substrate assembly, electronic device, and manufacturing method of substrate assembly |