JPS6437079U - - Google Patents
Info
- Publication number
- JPS6437079U JPS6437079U JP13250587U JP13250587U JPS6437079U JP S6437079 U JPS6437079 U JP S6437079U JP 13250587 U JP13250587 U JP 13250587U JP 13250587 U JP13250587 U JP 13250587U JP S6437079 U JPS6437079 U JP S6437079U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pad
- lsi package
- solder side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のはんだ付け用パツドの一実施
例を示す斜視図、第２図は本考案によるＬＳＩパ
ツケージの塔載例を示す断面図である。
１１……印刷配線板、１２ａ〜１４ａ，１２ｂ
〜１４ｂ，３０ａ，３０ｂ，３１ａ，３１ｂ……
はんだ付け用パツド、１２ｃ〜１４ｃ，３０ｃ，
３１ｃ……スルホール接続、２０……ＬＳＩ。
FIG. 1 is a perspective view showing an embodiment of a soldering pad according to the present invention, and FIG. 2 is a sectional view showing an example of mounting an LSI package according to the present invention. 11...Printed wiring board, 12a to 14a, 12b
~14b, 30a, 30b, 31a, 31b...
Soldering pads, 12c to 14c, 30c,
31c...Through hole connection, 20...LSI.
Claims (1)
してなる印刷配線板において、印刷配線板の部品
面とはんだ面の両面に面実装形ＬＳＩパツケージ
はんだ付け用パツドを形成し、対応する部品面の
パツドとはんだ面のパツドとをそれぞれスルーホ
ール接続により電気的に接続したことを特徴とす
る表面実装用印刷配線板。 In a printed wiring board in which a surface-mounted LSI package is mounted on a printed wiring board, soldering pads for the surface-mounted LSI package are formed on both the component side and the solder side of the printed wiring board, and A printed wiring board for surface mounting, characterized in that the pad and the pad on the solder side are electrically connected by through-hole connections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13250587U JPS6437079U (en) | 1987-08-31 | 1987-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13250587U JPS6437079U (en) | 1987-08-31 | 1987-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437079U true JPS6437079U (en) | 1989-03-06 |
Family
ID=31389527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13250587U Pending JPS6437079U (en) | 1987-08-31 | 1987-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437079U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444177U (en) * | 1990-08-16 | 1992-04-15 |
-
1987
- 1987-08-31 JP JP13250587U patent/JPS6437079U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444177U (en) * | 1990-08-16 | 1992-04-15 |