JPH0320463U - - Google Patents
Info
- Publication number
- JPH0320463U JPH0320463U JP8085789U JP8085789U JPH0320463U JP H0320463 U JPH0320463 U JP H0320463U JP 8085789 U JP8085789 U JP 8085789U JP 8085789 U JP8085789 U JP 8085789U JP H0320463 U JPH0320463 U JP H0320463U
- Authority
- JP
- Japan
- Prior art keywords
- pitch
- printed wiring
- chip
- pads
- wiring chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図−１は本考案の一実施例に係る電子回路構造
体の斜視図、図−２はそれに用いるピツチ変換用
プリント配線チツプ、図−３は本考案の他の実施
例を示す要部の断面図である。
１……電子部品、２……プリント配線基板、３
……ピツチ変換用プリント配線チツプ、４……絶
縁チツプ、５……パツド、６……パツド、７……
中間配線パターン、８……パツド。
Fig. 1 is a perspective view of an electronic circuit structure according to an embodiment of the present invention, Fig. 2 is a printed wiring chip for pitch conversion used therein, and Fig. 3 is a cross section of main parts showing another embodiment of the present invention. It is a diagram. 1...Electronic component, 2...Printed wiring board, 3
... Printed wiring chip for pitch conversion, 4 ... Insulation chip, 5 ... Pad, 6 ... Pad, 7 ...
Intermediate wiring pattern, 8...padded.
Claims (1)
れたパツドと、それより大きなピツチで配列され
たパツドと、それらの間をつなぐ中間配線パター
ンとを形成したピツチ変換用プリント配線チツプ
を用い、このプリント配線チツプ上に上記小さな
ピツチと同じピツチのリードを有する電子部品を
実装し、かつ上記プリント配線チツプを上記大き
なピツチと同じピツチのパツドを有するプリント
配線基板上に実装したことを特徴とする電子回路
構造体。 Using a printed wiring chip for pitch conversion, which has pads arranged at a predetermined small pitch, pads arranged at a larger pitch, and an intermediate wiring pattern connecting between them on an insulating chip, this printed wiring chip is used. An electronic circuit characterized in that an electronic component having leads of the same pitch as the small pitch is mounted on a wiring chip, and the printed wiring chip is mounted on a printed wiring board having pads of the same pitch as the large pitch. Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8085789U JPH0320463U (en) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8085789U JPH0320463U (en) | 1989-07-11 | 1989-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320463U true JPH0320463U (en) | 1991-02-28 |
Family
ID=31626279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8085789U Pending JPH0320463U (en) | 1989-07-11 | 1989-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320463U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002317424A (en) * | 2001-04-20 | 2002-10-31 | San Buresu:Kk | Construction surface protective material and construction surface protective timber |
-
1989
- 1989-07-11 JP JP8085789U patent/JPH0320463U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002317424A (en) * | 2001-04-20 | 2002-10-31 | San Buresu:Kk | Construction surface protective material and construction surface protective timber |