JPS6172878U - - Google Patents
Info
- Publication number
- JPS6172878U JPS6172878U JP15787884U JP15787884U JPS6172878U JP S6172878 U JPS6172878 U JP S6172878U JP 15787884 U JP15787884 U JP 15787884U JP 15787884 U JP15787884 U JP 15787884U JP S6172878 U JPS6172878 U JP S6172878U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- screws
- wiring board
- board
- solderable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図及び第２図は従来の電気的接続装置を示
す斜視図及び側面図、第３図は本考案の一実施例
を示す要部断面図、第４図は本考案に用いるビス
の他の例を示す斜視図である。
１……パワーＩＣ、２……印刷配線基板、３…
…放熱板、１１……ハンダ付け可能なビス。
1 and 2 are a perspective view and a side view showing a conventional electrical connection device, FIG. 3 is a cross-sectional view of a main part showing an embodiment of the present invention, and FIG. 4 is a diagram showing screws and other parts used in the present invention. It is a perspective view showing an example. 1...Power IC, 2...Printed wiring board, 3...
...Heat sink, 11...Solderable screws.
Claims (1)
熱板を取付けるとともに、この放熱板に半田付け
可能なビスを締め付け、このビスの先端を上記印
刷配線基板にあけられた孔に通して印刷配線基板
の銅箔面に半田付けしたことを特徴とする電気的
接続装置。 Attach metal heat sinks at specified intervals on the printed wiring board, tighten solderable screws to the heat sink, and pass the tips of the screws through the holes drilled in the printed wiring board to connect the printed wiring. An electrical connection device characterized by soldering to the copper foil surface of a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15787884U JPS6172878U (en) | 1984-10-19 | 1984-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15787884U JPS6172878U (en) | 1984-10-19 | 1984-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6172878U true JPS6172878U (en) | 1986-05-17 |
Family
ID=30715868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15787884U Pending JPS6172878U (en) | 1984-10-19 | 1984-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172878U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013062413A (en) * | 2011-09-14 | 2013-04-04 | Mitsubishi Electric Corp | Semiconductor device |
-
1984
- 1984-10-19 JP JP15787884U patent/JPS6172878U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013062413A (en) * | 2011-09-14 | 2013-04-04 | Mitsubishi Electric Corp | Semiconductor device |
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