JPS6280392U - - Google Patents
Info
- Publication number
- JPS6280392U JPS6280392U JP17189585U JP17189585U JPS6280392U JP S6280392 U JPS6280392 U JP S6280392U JP 17189585 U JP17189585 U JP 17189585U JP 17189585 U JP17189585 U JP 17189585U JP S6280392 U JPS6280392 U JP S6280392U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- circuit board
- electric circuit
- heat
- arranged opposite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 230000035515 penetration Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Description
第1図は本考案による放熱機構の構成を示す要
部斜視図、第2図は第1図の矢印A側から示す要
部平面図、第3図は第2図のBB線矢視断面図、
第4図は電源回路の問題点を説明するブロツク図
、第5図は第4図の直流―直流変換器の一内部構
成を示す回路図、第6図は本考案の他の実施例を
示す斜視図、第7図は第6図の矢印C側から示す
要部平面図、第8図は第7図のDD線矢視断面図
、第9図、第10図、第11図は従来の放熱機構
の一例を示す要部平面図である。
20:外部ケース、20a:外部ケースの裏面
、21:電気回路基板、22:穴(貫通部)、2
3,25:放熱部材、24:部品。
Fig. 1 is a perspective view of the main parts showing the configuration of the heat dissipation mechanism according to the present invention, Fig. 2 is a plan view of the main parts taken from the arrow A side in Fig. 1, and Fig. 3 is a sectional view taken along the line BB in Fig. 2. ,
Fig. 4 is a block diagram explaining the problems of the power supply circuit, Fig. 5 is a circuit diagram showing the internal configuration of the DC-DC converter shown in Fig. 4, and Fig. 6 shows another embodiment of the present invention. A perspective view, FIG. 7 is a plan view of the main part taken from the arrow C side in FIG. 6, FIG. 8 is a sectional view taken along the line DD in FIG. 7, and FIGS. FIG. 3 is a plan view of main parts showing an example of a heat dissipation mechanism. 20: External case, 20a: Back side of external case, 21: Electric circuit board, 22: Hole (penetrating part), 2
3, 25: heat dissipation member, 24: component.
Claims (1)
共に該電気回路基板の該放熱板側を裏面とし、該
電気回路基板の所定位置に貫通部を形成すると共
に貫通部に相対向する放熱部材を放熱板に突設し
、電気回路基板の表面側に取り付けられ且つ放熱
すべき部品等を該貫通部を介して該放熱部材の一
端に固定するようにしたことを特徴とする放熱機
構。 An electric circuit board is arranged opposite to the heat sink, the heat sink side of the electric circuit board is the back surface, a penetration part is formed at a predetermined position of the electric circuit board, and a heat dissipation member is arranged opposite to the penetration part. A heat dissipation mechanism, characterized in that the heat dissipation mechanism is protruded from a heat dissipation plate, is attached to the surface side of an electric circuit board, and a component or the like to be heat dissipated is fixed to one end of the heat dissipation member via the through portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17189585U JPS6280392U (en) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17189585U JPS6280392U (en) | 1985-11-08 | 1985-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6280392U true JPS6280392U (en) | 1987-05-22 |
Family
ID=31107945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17189585U Pending JPS6280392U (en) | 1985-11-08 | 1985-11-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6280392U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196515A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Works Ltd | Heat dissipation structure and method of manufacture |
JP2002217574A (en) * | 2001-01-12 | 2002-08-02 | Matsushita Electric Works Ltd | Power converter |
JP2011172431A (en) * | 2010-02-22 | 2011-09-01 | Daikin Industries Ltd | Switching power supply circuit |
JP2018032775A (en) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | Electronic component heat dissipation structure and assembly method therefor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60100457A (en) * | 1983-11-04 | 1985-06-04 | Matsushita Electric Ind Co Ltd | Heat sink device of electronic component |
-
1985
- 1985-11-08 JP JP17189585U patent/JPS6280392U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60100457A (en) * | 1983-11-04 | 1985-06-04 | Matsushita Electric Ind Co Ltd | Heat sink device of electronic component |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196515A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Works Ltd | Heat dissipation structure and method of manufacture |
JP2002217574A (en) * | 2001-01-12 | 2002-08-02 | Matsushita Electric Works Ltd | Power converter |
JP2011172431A (en) * | 2010-02-22 | 2011-09-01 | Daikin Industries Ltd | Switching power supply circuit |
JP2018032775A (en) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | Electronic component heat dissipation structure and assembly method therefor |