JPH02127090U - - Google Patents
Info
- Publication number
- JPH02127090U JPH02127090U JP3678089U JP3678089U JPH02127090U JP H02127090 U JPH02127090 U JP H02127090U JP 3678089 U JP3678089 U JP 3678089U JP 3678089 U JP3678089 U JP 3678089U JP H02127090 U JPH02127090 U JP H02127090U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal plate
- flexible printed
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のフレキシブル印刷配線板と金
属板とシリコン樹脂との関係を示す分解斜視図、
第２図は組立後の印刷配線板を示す斜視図、第３
図は第２図Ａ部拡大図である。
１…フレキシブル印刷配線板、２…シリコン樹
脂、３…金属板、４…位置決め部、５…印刷配線
板。
FIG. 1 is an exploded perspective view showing the relationship between the flexible printed wiring board of the present invention, the metal plate, and the silicone resin;
Figure 2 is a perspective view showing the printed wiring board after assembly;
The figure is an enlarged view of part A in FIG. DESCRIPTION OF SYMBOLS 1... Flexible printed wiring board, 2... Silicone resin, 3... Metal plate, 4... Positioning part, 5... Printed wiring board.
Claims (1)
レキシブル印刷配線板に熱伝導に優れた絶縁性樹
脂にて貼り合せたことを特徴とする印刷配線板。 A printed wiring board characterized in that, in its structure, a heat dissipation metal plate is bonded to a flexible printed wiring board with an insulating resin having excellent heat conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3678089U JPH02127090U (en) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3678089U JPH02127090U (en) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127090U true JPH02127090U (en) | 1990-10-19 |
Family
ID=31543314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3678089U Pending JPH02127090U (en) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127090U (en) |
-
1989
- 1989-03-30 JP JP3678089U patent/JPH02127090U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02127090U (en) | ||
| JPS6280392U (en) | ||
| JPS63170996U (en) | ||
| JPS61182096U (en) | ||
| JPS61144678U (en) | ||
| JPS6346899U (en) | ||
| JPH0170349U (en) | ||
| JPS61179752U (en) | ||
| JPS5853196U (en) | Heat dissipation mechanism | |
| JPS6219788U (en) | ||
| JPS6186946U (en) | ||
| JPS60176594U (en) | Heat dissipation structure of printed circuit board | |
| JPS624137U (en) | ||
| JPS6320499U (en) | ||
| JPH0227759U (en) | ||
| JPH0416045U (en) | ||
| JPH0338693U (en) | ||
| JPS63170964U (en) | ||
| JPS61205196U (en) | ||
| JPH0298647U (en) | ||
| JPS6268297U (en) | ||
| JPH03102791U (en) | ||
| JPS6228446U (en) | ||
| JPS61132284U (en) | ||
| JPS61140577U (en) |