JPS61182096U - - Google Patents
Info
- Publication number
- JPS61182096U JPS61182096U JP6661585U JP6661585U JPS61182096U JP S61182096 U JPS61182096 U JP S61182096U JP 6661585 U JP6661585 U JP 6661585U JP 6661585 U JP6661585 U JP 6661585U JP S61182096 U JPS61182096 U JP S61182096U
- Authority
- JP
- Japan
- Prior art keywords
- convex portion
- component
- metal plate
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案に係る印刷配線板の一実施例を
示す縦断面図、第２図は本考案の他の実施例を示
す縦断面図、第３図は本考案の一実施例による熱
伝導を示す系統図、第４図は従来の印刷配線板を
示す分解斜視図、第５図は第４図の縦断面図、第
６図は従来の印刷配線板の熱伝導を示す系統図で
ある。
１……銅張積層板、１ａ……孔部、２……金属
板、２ａ……凸部、６……ＩＣ（部品）、７……
接着剤またはグリース。
FIG. 1 is a vertical cross-sectional view showing one embodiment of a printed wiring board according to the present invention, FIG. 2 is a vertical cross-sectional view showing another embodiment of the present invention, and FIG. Fig. 4 is an exploded perspective view showing a conventional printed wiring board, Fig. 5 is a vertical cross-sectional view of Fig. 4, and Fig. 6 is a system diagram showing heat conduction in a conventional printed wiring board. be. DESCRIPTION OF SYMBOLS 1... Copper-clad laminate, 1a... Hole, 2... Metal plate, 2a... Convex part, 6... IC (component), 7...
adhesive or grease.
Claims (1)
この孔部に嵌合する凸部を形成した金属板とを貼
り合せてなり、前記部品と前記凸部とを当接し、
前記部品で発生した熱を前記凸部を介して金属板
に放熱させたことを特徴とする印刷配線板。 A copper-clad laminate with holes formed at component mounting positions,
A metal plate having a convex portion that fits into the hole is bonded together, and the component and the convex portion are brought into contact with each other,
A printed wiring board characterized in that heat generated in the component is radiated to a metal plate via the convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6661585U JPS61182096U (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6661585U JPS61182096U (en) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61182096U true JPS61182096U (en) | 1986-11-13 |
Family
ID=30599692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6661585U Pending JPS61182096U (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182096U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387870U (en) * | 1986-11-25 | 1988-06-08 | ||
| JPH0444177U (en) * | 1990-08-16 | 1992-04-15 |
-
1985
- 1985-05-07 JP JP6661585U patent/JPS61182096U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387870U (en) * | 1986-11-25 | 1988-06-08 | ||
| JPH0444177U (en) * | 1990-08-16 | 1992-04-15 |
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