JPS6186946U - - Google Patents

Info

Publication number
JPS6186946U
JPS6186946U JP17213584U JP17213584U JPS6186946U JP S6186946 U JPS6186946 U JP S6186946U JP 17213584 U JP17213584 U JP 17213584U JP 17213584 U JP17213584 U JP 17213584U JP S6186946 U JPS6186946 U JP S6186946U
Authority
JP
Japan
Prior art keywords
heat sink
electronic component
spring material
mounting device
positioning portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17213584U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17213584U priority Critical patent/JPS6186946U/ja
Publication of JPS6186946U publication Critical patent/JPS6186946U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す構成断面図、
第2図は第1図におけるばね材の構成を示す溝成
図でaは側面図bは正面図である。第3図は従来
の構成を示す斜視図である。 1……電子部品、2……ヒートシンク、3……
ばね材、5……プリント板、6……位置決め部、
7……嵌合部、8……押圧部。
FIG. 1 is a sectional view showing an embodiment of the present invention;
FIG. 2 is a groove diagram showing the structure of the spring material in FIG. 1, and a is a side view and b is a front view. FIG. 3 is a perspective view showing a conventional configuration. 1...Electronic component, 2...Heat sink, 3...
Spring material, 5... Printed board, 6... Positioning part,
7... Fitting part, 8... Pressing part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント板にマウントされるヒートシンクと、
該ヒートシンクに電子部品を押圧固定するばね材
とを備えた電子部品の取付装置において、前記ヒ
ートシンクに位置決め部を設けるとともに、前記
ばね材に前記位置決め部と嵌合する嵌合手段と、
電子部品を押圧する2以上に分割された押圧部と
を設けたことを特徴とする電子部品の取付装置。
A heat sink mounted on a printed board,
A mounting device for an electronic component comprising a spring material that presses and fixes an electronic component to the heat sink, wherein the heat sink is provided with a positioning portion, and a fitting means that fits the spring material with the positioning portion;
1. A mounting device for electronic components, characterized by comprising a pressing section divided into two or more parts for pressing an electronic component.
JP17213584U 1984-11-13 1984-11-13 Pending JPS6186946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17213584U JPS6186946U (en) 1984-11-13 1984-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17213584U JPS6186946U (en) 1984-11-13 1984-11-13

Publications (1)

Publication Number Publication Date
JPS6186946U true JPS6186946U (en) 1986-06-07

Family

ID=30729810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17213584U Pending JPS6186946U (en) 1984-11-13 1984-11-13

Country Status (1)

Country Link
JP (1) JPS6186946U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273860A (en) * 2006-03-31 2007-10-18 Icom Inc Clip for fixing semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273860A (en) * 2006-03-31 2007-10-18 Icom Inc Clip for fixing semiconductor element

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