JPH03117891U - - Google Patents

Info

Publication number
JPH03117891U
JPH03117891U JP2723990U JP2723990U JPH03117891U JP H03117891 U JPH03117891 U JP H03117891U JP 2723990 U JP2723990 U JP 2723990U JP 2723990 U JP2723990 U JP 2723990U JP H03117891 U JPH03117891 U JP H03117891U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
heating element
heat sink
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2723990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2723990U priority Critical patent/JPH03117891U/ja
Publication of JPH03117891U publication Critical patent/JPH03117891U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の斜視図、第2図は
本考案の他の実施例を示す放熱板の斜視図、第3
図は従来の取付装置の斜視図である。 1……プリント基板、1a,1b……孔、2…
…発熱体、3……放熱板、3a,3b,3c……
突起。
FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view of a heat sink showing another embodiment of the present invention, and FIG.
The figure is a perspective view of a conventional mounting device. 1...Printed circuit board, 1a, 1b...hole, 2...
...Heating element, 3... Heat sink, 3a, 3b, 3c...
protrusion.

Claims (1)

【実用新案登録請求の範囲】 電子部品が取付けられたプリント基板と、該プ
リント基板に取付けられた発熱体と、該発熱体を
挾持して放熱する放熱板とを備え、 上記放熱板は、上記プリント基板と対向する面
に突起が形成され、上記プリント基板に設けられ
た孔に嵌着されて固定されることを特徴とする発
熱体の取付装置。
[Claims for Utility Model Registration] A printed circuit board on which electronic components are attached, a heating element attached to the printed circuit board, and a heat sink that radiates heat by sandwiching the heating element, the heat sink comprising: 1. A mounting device for a heating element, characterized in that a protrusion is formed on a surface facing a printed circuit board, and is fitted and fixed into a hole provided in the printed circuit board.
JP2723990U 1990-03-19 1990-03-19 Pending JPH03117891U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2723990U JPH03117891U (en) 1990-03-19 1990-03-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2723990U JPH03117891U (en) 1990-03-19 1990-03-19

Publications (1)

Publication Number Publication Date
JPH03117891U true JPH03117891U (en) 1991-12-05

Family

ID=31530104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2723990U Pending JPH03117891U (en) 1990-03-19 1990-03-19

Country Status (1)

Country Link
JP (1) JPH03117891U (en)

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