JPH0465493U - - Google Patents

Info

Publication number
JPH0465493U
JPH0465493U JP10814790U JP10814790U JPH0465493U JP H0465493 U JPH0465493 U JP H0465493U JP 10814790 U JP10814790 U JP 10814790U JP 10814790 U JP10814790 U JP 10814790U JP H0465493 U JPH0465493 U JP H0465493U
Authority
JP
Japan
Prior art keywords
heat sink
circuit board
board
printed
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10814790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10814790U priority Critical patent/JPH0465493U/ja
Publication of JPH0465493U publication Critical patent/JPH0465493U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の第1の実施例の平面図、第
2図はその−線断面図、第3図は縦断面図、
第4図は第2の実施例の平面図、第5図はその正
面図である。 1……プリント基板、2……放熱板、3……サ
ブプリント基板、4……発熱部品、14……電子
部品。
FIG. 1 is a plan view of the first embodiment of this invention, FIG. 2 is a sectional view taken along the line 2, and FIG. 3 is a longitudinal sectional view thereof.
FIG. 4 is a plan view of the second embodiment, and FIG. 5 is a front view thereof. 1... Printed circuit board, 2... Heat sink, 3... Sub-printed board, 4... Heat generating component, 14... Electronic component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 縦姿勢に配置されるものであつて発熱部品を上
端部に実装したプリント基板と、前記発熱部品を
被覆するコ字形であつて開口が上下方向に向くよ
うに両側部が前記プリント基板に取付けられた放
熱板と、前記プリント基板に直角に取付けられて
電子部品を前記放熱板と反対側に実装したサブプ
リント基板とを備えた回路基板装置。
A printed circuit board is arranged in a vertical position and has a heat-generating component mounted on its upper end; A circuit board device comprising: a heat sink; and a sub-print board mounted perpendicularly to the printed board and having electronic components mounted on the opposite side of the heat sink.
JP10814790U 1990-10-15 1990-10-15 Pending JPH0465493U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10814790U JPH0465493U (en) 1990-10-15 1990-10-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10814790U JPH0465493U (en) 1990-10-15 1990-10-15

Publications (1)

Publication Number Publication Date
JPH0465493U true JPH0465493U (en) 1992-06-08

Family

ID=31854981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10814790U Pending JPH0465493U (en) 1990-10-15 1990-10-15

Country Status (1)

Country Link
JP (1) JPH0465493U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465494U (en) * 1990-10-15 1992-06-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465494U (en) * 1990-10-15 1992-06-08

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