JPH0377491U - - Google Patents
Info
- Publication number
- JPH0377491U JPH0377491U JP13903089U JP13903089U JPH0377491U JP H0377491 U JPH0377491 U JP H0377491U JP 13903089 U JP13903089 U JP 13903089U JP 13903089 U JP13903089 U JP 13903089U JP H0377491 U JPH0377491 U JP H0377491U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic component
- metal case
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
Description
第１図は本考案の実施例の正面図、第２図は従
来の電気部品の斜視図を示す。
１……印刷配線板、２，５……電子部品、３…
…金属ケース。
FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional electrical component. 1...Printed wiring board, 2, 5...Electronic components, 3...
...Metal case.
Claims (1)
板とこの電子部品とを金属ケースで覆つた電気部
品において、発熱を伴う電子部品を金属ケースに
取付け印刷配線板に接続することを特徴とする電
気部品。 An electrical component in which an electronic component is connected to a printed wiring board, and the printed wiring board and the electronic component are covered with a metal case, characterized in that the electronic component that generates heat is attached to the metal case and connected to the printed wiring board. Electrical component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13903089U JPH0377491U (en) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13903089U JPH0377491U (en) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377491U true JPH0377491U (en) | 1991-08-05 |
Family
ID=31686100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13903089U Pending JPH0377491U (en) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179584A (en) * | 2004-12-21 | 2006-07-06 | Kiko Kagi Kofun Yugenkoshi | Mechanism of heat dissipation module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6052629B2 (en) * | 1976-04-16 | 1985-11-20 | ソニー株式会社 | Recorded recording medium and its production method |
-
1989
- 1989-11-30 JP JP13903089U patent/JPH0377491U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6052629B2 (en) * | 1976-04-16 | 1985-11-20 | ソニー株式会社 | Recorded recording medium and its production method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179584A (en) * | 2004-12-21 | 2006-07-06 | Kiko Kagi Kofun Yugenkoshi | Mechanism of heat dissipation module |
| JP4560399B2 (en) * | 2004-12-21 | 2010-10-13 | 奇▲こう▼科技股▲ふん▼有限公司 | Mechanism of heat dissipation module for electronic devices |