JPS6190251U - - Google Patents
Info
- Publication number
- JPS6190251U JPS6190251U JP17525684U JP17525684U JPS6190251U JP S6190251 U JPS6190251 U JP S6190251U JP 17525684 U JP17525684 U JP 17525684U JP 17525684 U JP17525684 U JP 17525684U JP S6190251 U JPS6190251 U JP S6190251U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- showing
- view
- fin
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は従来のヒートシンク構造を示す斜視図
である。第２図は、従来のヒートシンク構造の実
装状態を示す平面図である。第３図及び第４図は
他の従来例を示す斜視図である。第５図は同実施
例の実装状態を示す平面図である。第６図は、本
考案に係るヒートシンク構造の第１の実施例を示
す斜視図である。第７図は、同実施例において第
１のヒートシンクの基部まで第２のヒートシンク
を嵌合した状態を示す正面図である。第８図は、
第７図における第１のヒートシンクの基部まで第
２のヒートシンクを嵌合していない状態を示す正
面図である。第９図は、同実施例を多層プリント
配線板に実装し、装置に取付けた状態を示す平面
図である。第１０図は、本考案に係るヒートシン
クの第２の実施例を示す平面図である。
１…セラミツク基板、２…第１のヒートシンク
、２ａ…フイン、３…彎曲部、４…第２のヒート
シンク、４ａ…フイン、５…基部、６…ヒートシ
ンク、７…多層プリント配線板。
FIG. 1 is a perspective view showing a conventional heat sink structure. FIG. 2 is a plan view showing the mounting state of a conventional heat sink structure. 3 and 4 are perspective views showing other conventional examples. FIG. 5 is a plan view showing the mounting state of the same embodiment. FIG. 6 is a perspective view showing a first embodiment of the heat sink structure according to the present invention. FIG. 7 is a front view showing a state in which the second heat sink is fitted up to the base of the first heat sink in the same embodiment. Figure 8 shows
8 is a front view showing a state in which the second heat sink is not fitted up to the base of the first heat sink in FIG. 7; FIG. FIG. 9 is a plan view showing the same embodiment mounted on a multilayer printed wiring board and attached to a device. FIG. 10 is a plan view showing a second embodiment of the heat sink according to the present invention. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... First heat sink, 2a... Fin, 3... Curved part, 4... Second heat sink, 4a... Fin, 5... Base, 6... Heat sink, 7... Multilayer printed wiring board.
Claims (1)
裏面に取付けられた第１のヒートシンクと、この
第１のヒートシンクに嵌合可能な彎曲部を先端に
形成したフインを有する第２のヒートシンクとか
らなることを特徴とするヒートシンク構造。 It consists of a first heat sink attached to the back side of a ceramic substrate on which an integrated circuit chip or the like is mounted, and a second heat sink having a fin with a curved part formed at the tip that can fit into the first heat sink. Features a heat sink structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17525684U JPS6190251U (en) | 1984-11-19 | 1984-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17525684U JPS6190251U (en) | 1984-11-19 | 1984-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6190251U true JPS6190251U (en) | 1986-06-12 |
Family
ID=30732860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17525684U Pending JPS6190251U (en) | 1984-11-19 | 1984-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190251U (en) |
-
1984
- 1984-11-19 JP JP17525684U patent/JPS6190251U/ja active Pending