JPS6242246U - - Google Patents
Info
- Publication number
- JPS6242246U JPS6242246U JP13461585U JP13461585U JPS6242246U JP S6242246 U JPS6242246 U JP S6242246U JP 13461585 U JP13461585 U JP 13461585U JP 13461585 U JP13461585 U JP 13461585U JP S6242246 U JPS6242246 U JP S6242246U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- bolt insertion
- resin layer
- insertion part
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 4
- 238000003780 insertion Methods 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例を示す樹脂封止型半導
体装置の正面図、第２図は第１図の装置の実装時
の側面図、第３図は本考案の他の実施例を示す正
面図、第４図は、従来の樹脂封止型半導体装置の
斜視図、第５図は第４図の装置の実装状態を示す
側面図、第６図は、装置の実装時における問題点
を示した側面図である。
１……ヒートシンク、３……樹脂層、４……リ
ード、５……印刷配線板、６……スルホール、７
……半田、８……放熱板、９……貫通穴、１０…
…ボルト、１１……長穴、１２……スリツト。
Figure 1 is a front view of a resin-sealed semiconductor device showing an embodiment of the present invention, Figure 2 is a side view of the device shown in Figure 1 when it is mounted, and Figure 3 is another embodiment of the invention. 4 is a front view, FIG. 4 is a perspective view of a conventional resin-sealed semiconductor device, FIG. 5 is a side view showing the mounting state of the device in FIG. 4, and FIG. 6 is a diagram showing problems when mounting the device. FIG. 1...Heat sink, 3...Resin layer, 4...Lead, 5...Printed wiring board, 6...Through hole, 7
... Solder, 8 ... Heat sink, 9 ... Through hole, 10 ...
...Bolt, 11...Elongated hole, 12...Slit.
Claims (1)
ートシンク上にマウントされた半導体チツプと、
前記ボルト挿入部付近を除くヒートシンク上に、
前記チツプを覆うように設けられた樹脂層と、前
記樹脂層の一側部から外部に延出され、該樹脂層
内で前記チツプとワイヤを介して接続された複数
のリードとを具備し、前記リードを、印刷配線板
のスルホールに挿入、実装した状態で、前記ヒー
トシンクをボルト挿入部を用いて放熱板とのボル
ト止めを行う樹脂封止型半導体装置において、前
記ヒートシンクのボルト挿入部が、長穴又は前記
リードの延出方向と逆方向に切り欠かれたスリツ
トからなることを特徴とする半導体装置。 a heat sink having a bolt insertion portion; a semiconductor chip mounted on the heat sink;
On the heat sink except for the vicinity of the bolt insertion part,
A resin layer provided to cover the chip, and a plurality of leads extending outside from one side of the resin layer and connected to the chip via wires within the resin layer, In a resin-sealed semiconductor device in which the heat sink is bolted to a heat sink using a bolt insertion part with the leads inserted and mounted in through-holes of a printed wiring board, the bolt insertion part of the heat sink includes: A semiconductor device comprising an elongated hole or a slit cut in a direction opposite to the direction in which the lead extends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13461585U JPH0325413Y2 (en) | 1985-09-03 | 1985-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13461585U JPH0325413Y2 (en) | 1985-09-03 | 1985-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6242246U true JPS6242246U (en) | 1987-03-13 |
| JPH0325413Y2 JPH0325413Y2 (en) | 1991-06-03 |
Family
ID=31036023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13461585U Expired JPH0325413Y2 (en) | 1985-09-03 | 1985-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325413Y2 (en) |
-
1985
- 1985-09-03 JP JP13461585U patent/JPH0325413Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0325413Y2 (en) | 1991-06-03 |