JPH01173967U - - Google Patents
Info
- Publication number
- JPH01173967U JPH01173967U JP6898388U JP6898388U JPH01173967U JP H01173967 U JPH01173967 U JP H01173967U JP 6898388 U JP6898388 U JP 6898388U JP 6898388 U JP6898388 U JP 6898388U JP H01173967 U JPH01173967 U JP H01173967U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- semiconductor
- semiconductor device
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例による半導体装置
の断面側面図、第２図は従来の半導体装置の断面
側面図である。
図において、１はパツケージ本体、２は金属製
リード、３ははんだ、４は配線層、５は配線基板
、６は突起、７は配線基板に設けられた穴を示す
。なお、図中、同一符号は同一、又は相当部分を
示す。
FIG. 1 is a cross-sectional side view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a cross-sectional side view of a conventional semiconductor device. In the figure, 1 is a package body, 2 is a metal lead, 3 is solder, 4 is a wiring layer, 5 is a wiring board, 6 is a protrusion, and 7 is a hole provided in the wiring board. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
なくとも１個の非金属性突起を設け、この突起が
半導体実装基板に設けられた穴に嵌合することを
特徴とする半導体装置。 A semiconductor device characterized in that at least one non-metallic protrusion is provided on the surface of a semiconductor package having metal leads, and the protrusion fits into a hole provided in a semiconductor mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6898388U JPH01173967U (en) | 1988-05-25 | 1988-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6898388U JPH01173967U (en) | 1988-05-25 | 1988-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173967U true JPH01173967U (en) | 1989-12-11 |
Family
ID=31294275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6898388U Pending JPH01173967U (en) | 1988-05-25 | 1988-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173967U (en) |
-
1988
- 1988-05-25 JP JP6898388U patent/JPH01173967U/ja active Pending