JPS6447057U - - Google Patents
Info
- Publication number
- JPS6447057U JPS6447057U JP14263687U JP14263687U JPS6447057U JP S6447057 U JPS6447057 U JP S6447057U JP 14263687 U JP14263687 U JP 14263687U JP 14263687 U JP14263687 U JP 14263687U JP S6447057 U JPS6447057 U JP S6447057U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- external lead
- notch
- hole
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図は本考案の第１及び第２の実
施例を示す半導体装置の部分斜視図、第３図は従
来の半導体装置の実装状態を示す部分斜視図であ
る。
１…封止部、２…外部リード、３…孔、４…切
込み、５…配線基板、６…配線。
1 and 2 are partial perspective views of semiconductor devices showing first and second embodiments of the present invention, and FIG. 3 is a partial perspective view showing a conventional semiconductor device in a mounted state. DESCRIPTION OF SYMBOLS 1... Sealing part, 2... External lead, 3... Hole, 4... Notch, 5... Wiring board, 6... Wiring.
Claims (1)
半導体装置において、前記外部リードの先端部に
はんだを吸引するための少くとも１個以上の孔又
は切込みを有することを特徴とする半導体装置。 1. A semiconductor device having an in-line sealed external lead, the semiconductor device having at least one hole or notch for sucking solder at the tip of the external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14263687U JPS6447057U (en) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14263687U JPS6447057U (en) | 1987-09-17 | 1987-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447057U true JPS6447057U (en) | 1989-03-23 |
Family
ID=31408760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14263687U Pending JPS6447057U (en) | 1987-09-17 | 1987-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447057U (en) |
-
1987
- 1987-09-17 JP JP14263687U patent/JPS6447057U/ja active Pending