JPH02104671U - - Google Patents
Info
- Publication number
- JPH02104671U JPH02104671U JP1231389U JP1231389U JPH02104671U JP H02104671 U JPH02104671 U JP H02104671U JP 1231389 U JP1231389 U JP 1231389U JP 1231389 U JP1231389 U JP 1231389U JP H02104671 U JPH02104671 U JP H02104671U
- Authority
- JP
- Japan
- Prior art keywords
- board
- metal
- parts
- mounting structure
- package parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例によるメタルキヤ
ンパツケージ部品の取付構造を示す斜視図、第２
図ａ，ｂはこの考案の他の実施例の金属箔の表面
形状を示す斜視図、第３図は従来の取付構造を示
す斜視図である。
図において、１はメタルキヤンパツケージ部品
、２は基板、３は金属箔、４はボンデイング、５
は基板の穴、６は基板のＧＮＤ面を示す。なお、
図中、同一符号は同一、又は相当部分を示す。
Fig. 1 is a perspective view showing the mounting structure of metal package cage parts according to one embodiment of this invention;
Figures a and b are perspective views showing the surface shape of a metal foil according to another embodiment of this invention, and Figure 3 is a perspective view showing a conventional mounting structure. In the figure, 1 is a metal package part, 2 is a board, 3 is a metal foil, 4 is a bonding part, and 5 is a metal package part.
6 shows the hole in the board, and 6 shows the GND plane of the board. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
場合、部品が接触する基板に金属箔を熱圧着で取
付けることを特徴とするメタルキヤンパツケージ
部品の取付構造。 A mounting structure for metal can package parts, which is characterized in that when attaching metal can package parts to a board, metal foil is attached to the board with which the parts come into contact by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1231389U JPH02104671U (en) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1231389U JPH02104671U (en) | 1989-02-03 | 1989-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104671U true JPH02104671U (en) | 1990-08-20 |
Family
ID=31221647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1231389U Pending JPH02104671U (en) | 1989-02-03 | 1989-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104671U (en) |
-
1989
- 1989-02-03 JP JP1231389U patent/JPH02104671U/ja active Pending