JPH03115407U - - Google Patents
Info
- Publication number
- JPH03115407U JPH03115407U JP2404590U JP2404590U JPH03115407U JP H03115407 U JPH03115407 U JP H03115407U JP 2404590 U JP2404590 U JP 2404590U JP 2404590 U JP2404590 U JP 2404590U JP H03115407 U JPH03115407 U JP H03115407U
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- integrated circuit
- chip capacitor
- hole
- microwave integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図はこの考案の一実施例によるマイクロ波
集積回路の平面図、第２図は第１図の−線に
おける断面図、第３図は従来のマイクロ波集積回
路の平面図、第４図は第３図の−線における
断面図である。
図において、１はキヤリア、２は誘電体基板、
３は伝送線路、４はチツプコンデンサ、５ａ，５
ｂはチツプコンデンサ４の電極、６は金ワイヤ、
７はスルーホール、８はキヤリア１の凸形状部を
示す。なお、図中、同一符号は同一、又は相当部
分を示す。
FIG. 1 is a plan view of a microwave integrated circuit according to an embodiment of this invention, FIG. 2 is a sectional view taken along the line - in FIG. 1, FIG. 3 is a plan view of a conventional microwave integrated circuit, and FIG. is a cross-sectional view taken along the - line in FIG. 3; In the figure, 1 is a carrier, 2 is a dielectric substrate,
3 is a transmission line, 4 is a chip capacitor, 5a, 5
b is the electrode of the chip capacitor 4, 6 is the gold wire,
7 indicates a through hole, and 8 indicates a convex portion of the carrier 1. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
取付けて構成するマイクロ波集積回路において、
前記誘電体基板にスルーホールを形成し、このス
ルーホール直下の前記キヤリアを凸形状とし、こ
の凸形状キヤリアに前記チツプコンデンサを取付
けたことを特徴とするマイクロ波集積回路。 In a microwave integrated circuit configured by attaching a dielectric substrate and a chip capacitor to a carrier,
A microwave integrated circuit characterized in that a through-hole is formed in the dielectric substrate, the carrier directly under the through-hole has a convex shape, and the chip capacitor is attached to the convex-shaped carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404590U JPH03115407U (en) | 1990-03-08 | 1990-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404590U JPH03115407U (en) | 1990-03-08 | 1990-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03115407U true JPH03115407U (en) | 1991-11-28 |
Family
ID=31527023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2404590U Pending JPH03115407U (en) | 1990-03-08 | 1990-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03115407U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012109502A (en) * | 2010-11-19 | 2012-06-07 | Toshiba Corp | High-frequency circuit |
-
1990
- 1990-03-08 JP JP2404590U patent/JPH03115407U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012109502A (en) * | 2010-11-19 | 2012-06-07 | Toshiba Corp | High-frequency circuit |