JPH036839U - - Google Patents
Info
- Publication number
- JPH036839U JPH036839U JP6650489U JP6650489U JPH036839U JP H036839 U JPH036839 U JP H036839U JP 6650489 U JP6650489 U JP 6650489U JP 6650489 U JP6650489 U JP 6650489U JP H036839 U JPH036839 U JP H036839U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- semiconductor integrated
- semiconductor device
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図a、同図bは本考案の半導体装置用パツ
ケージの一実施例を示す縦断面図、第1図bは同
図aのA部詳細を示す部分断面図、第2図は従来
の半導体装置用パツケージを示す縦断面図である
。
1……キヤツプ、2……パツケージ、3……半
導体集積回路、4……リード、5…形状記憶合金
、6……めつき層。
1a and 1b are vertical cross-sectional views showing one embodiment of the semiconductor device package of the present invention, FIG. 1b is a partial cross-sectional view showing details of section A in FIG. FIG. 2 is a longitudinal cross-sectional view showing a package for a semiconductor device. 1...Cap, 2...Package, 3...Semiconductor integrated circuit, 4...Lead, 5...Shape memory alloy, 6...Plating layer.
Claims (1)
積回路の電気的接合を行うリードを備えた半導体
装置用パツケージにおいて、形状記憶合金よりな
る前記リードを備えたことを特徴とする半導体装
置用パツケージ。 What is claimed is: 1. A semiconductor device package comprising a lead for mounting a semiconductor integrated circuit and electrically connecting the semiconductor integrated circuit, characterized in that the lead is made of a shape memory alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6650489U JPH036839U (en) | 1989-06-06 | 1989-06-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6650489U JPH036839U (en) | 1989-06-06 | 1989-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH036839U true JPH036839U (en) | 1991-01-23 |
Family
ID=31599288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6650489U Pending JPH036839U (en) | 1989-06-06 | 1989-06-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH036839U (en) |
-
1989
- 1989-06-06 JP JP6650489U patent/JPH036839U/ja active Pending