JPH01165649U - - Google Patents
Info
- Publication number
- JPH01165649U JPH01165649U JP1988063106U JP6310688U JPH01165649U JP H01165649 U JPH01165649 U JP H01165649U JP 1988063106 U JP1988063106 U JP 1988063106U JP 6310688 U JP6310688 U JP 6310688U JP H01165649 U JPH01165649 U JP H01165649U
- Authority
- JP
- Japan
- Prior art keywords
- metallized layer
- sealing
- insulator
- package
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第１図、第２図はそれぞれ本考案の第１実施例
、第２実施例の縦断面図、第３図は従来例の縦断
面図である。
１１……蓋絶縁体、１２……Ｗメタライズ層、
１３，２３……アルミナ絶縁体層、１４……Ｎｉ
メツキ、１５……Ａｕメツキ、１６……Ａｕ／Ｓ
ｎソルダ、１７……パツケージ箱体。
1 and 2 are longitudinal sectional views of a first embodiment and a second embodiment of the present invention, respectively, and FIG. 3 is a longitudinal sectional view of a conventional example. 11... Lid insulator, 12... W metallized layer,
13, 23...Alumina insulator layer, 14...Ni
Metsuki, 15...Au Metsuki, 16...Au/S
n solder, 17...Package box body.
Claims (1)
層を全面に形成している半導体装置用パツケージ
において、前記蓋部は、そのメタライズ層上の中
央部に周縁の封着部に近く絶縁体層を設け、少な
くとも封止部にあたるメタライズ層上に封着メツ
キ層を施したものであることを特徴とする半導体
装置用パツケージ。 In a package for a semiconductor device in which a metallized layer is formed entirely on the sealing surface side of a lid made of an insulator, the lid has an insulator in the center part on the metallized layer near the peripheral sealing part. 1. A package for a semiconductor device, comprising a sealing plating layer on at least a metallized layer corresponding to a sealing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063106U JPH01165649U (en) | 1988-05-12 | 1988-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063106U JPH01165649U (en) | 1988-05-12 | 1988-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165649U true JPH01165649U (en) | 1989-11-20 |
Family
ID=31288635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063106U Pending JPH01165649U (en) | 1988-05-12 | 1988-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165649U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758232A (en) * | 1993-08-12 | 1995-03-03 | Nec Corp | Glass sealed ic package |
| JPH09199622A (en) * | 1996-01-18 | 1997-07-31 | Ngk Spark Plug Co Ltd | Metal lid substrate for electronic part package, metal lid, and its manufacturing method |
| WO2007094284A1 (en) * | 2006-02-15 | 2007-08-23 | Neomax Materials Co., Ltd. | Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap |
| JP2015073027A (en) * | 2013-10-03 | 2015-04-16 | 日立金属株式会社 | Cap for hermetic seal, package for electronic component and method of manufacturing cap for hermetic seal |
-
1988
- 1988-05-12 JP JP1988063106U patent/JPH01165649U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758232A (en) * | 1993-08-12 | 1995-03-03 | Nec Corp | Glass sealed ic package |
| JPH09199622A (en) * | 1996-01-18 | 1997-07-31 | Ngk Spark Plug Co Ltd | Metal lid substrate for electronic part package, metal lid, and its manufacturing method |
| WO2007094284A1 (en) * | 2006-02-15 | 2007-08-23 | Neomax Materials Co., Ltd. | Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap |
| JPWO2007094284A1 (en) * | 2006-02-15 | 2009-07-09 | 株式会社Ｎｅｏｍａｘマテリアル | Hermetic sealing cap, electronic component storage package, and manufacturing method of hermetic sealing cap |
| US7790988B2 (en) | 2006-02-15 | 2010-09-07 | Neomax Materials Co., Ltd. | Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap |
| JP4630338B2 (en) * | 2006-02-15 | 2011-02-09 | 株式会社Ｎｅｏｍａｘマテリアル | HERMETIC SEALING CAP, ELECTRONIC COMPONENT STORAGE PACKAGE, AND HERMETIC SEALING CAP MANUFACTURING METHOD |
| JP2015073027A (en) * | 2013-10-03 | 2015-04-16 | 日立金属株式会社 | Cap for hermetic seal, package for electronic component and method of manufacturing cap for hermetic seal |