JPH0317650U - - Google Patents
Info
- Publication number
- JPH0317650U JPH0317650U JP7882489U JP7882489U JPH0317650U JP H0317650 U JPH0317650 U JP H0317650U JP 7882489 U JP7882489 U JP 7882489U JP 7882489 U JP7882489 U JP 7882489U JP H0317650 U JPH0317650 U JP H0317650U
- Authority
- JP
- Japan
- Prior art keywords
- internal
- lead
- semiconductor chip
- leads
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 1
Description
第１図ａは本考案の第１の実施例であるリード
フレームを示す平面図、第１図ｂは第１図ａのＡ
−Ａ′線断面図、第２図ａ及び第２図ｂは第１図
ａのリードフレームに形状サイズの異なる半導体
チツプを各々実装した状態を示す部分断面図、第
３図ａは本考案の第２の実施例であるリードフレ
ームの平面図、第３図ｂは第３図ａのＢ−Ｂ′線
断面図、第３図ｃは第３図ａのＣ−Ｃ′線断面図
、第４図は従来のリードフレームの一例を示す平
面図、第５図は従来のリードフレームの他の例を
示す平面図である。
１…リードフレーム本体、２…外部リード、３
…内部リード、３ａ…内部リードの上面、５…絶
縁性被膜、６，８…半導体チツプ、１０…絶縁物
、１０ａ…絶縁物の上面。
FIG. 1a is a plan view showing a lead frame which is the first embodiment of the present invention, and FIG. 1b is A of FIG. 1a.
2a and 2b are partial sectional views showing semiconductor chips of different shapes and sizes mounted on the lead frame of FIG. 1a, and FIG. 3a is a cross-sectional view of the present invention. 3b is a sectional view taken along line B-B' in FIG. 3a, FIG. 3c is a sectional view taken along line C-C' in FIG. 3a, and FIG. FIG. 4 is a plan view showing an example of a conventional lead frame, and FIG. 5 is a plan view showing another example of the conventional lead frame. 1... Lead frame body, 2... External lead, 3
...Internal lead, 3a...Top surface of internal lead, 5...Insulating coating, 6, 8...Semiconductor chip, 10...Insulator, 10a...Top surface of insulator.
Claims (1)
る内部リードと、この内部リードと一体に形成さ
れた外部リードとを備えたリードフレームにおい
て、前記内部リードは前記半導体チツプの中心方
向に延び、前記内部リードどうしを互いに連結す
る複数の絶縁性被膜が前記内部リードの上に設け
られていることを特徴とするリードフレーム。 (2) 半導体チツプとワイヤーボンデイングされ
る内部リードと、この内部リードと一体に形成さ
れた外部リードとを備えたリードフレームにおい
て、前記内部リードは前記半導体チツプの中心方
向に延び、前記内部リードどうしを互いに連結す
る絶縁物が、前記内部リードどうしの対向部分に
設けられ、前記絶縁物の上面が前記内部リードの
上面より高い位置にあることを特徴とするリード
フレーム。[Claims for Utility Model Registration] (1) In a lead frame including an internal lead wire-bonded to a semiconductor chip and an external lead formed integrally with the internal lead, the internal lead is located at the center of the semiconductor chip. 1. A lead frame comprising: a plurality of insulating coatings extending in the direction and connecting the internal leads to each other; provided on the internal leads. (2) In a lead frame including an internal lead wire-bonded to a semiconductor chip and an external lead formed integrally with the internal lead, the internal lead extends toward the center of the semiconductor chip, and the internal leads are connected to each other. A lead frame characterized in that an insulator connecting the inner leads to each other is provided at opposing portions of the inner leads, and the upper surface of the insulator is located at a higher position than the upper surface of the inner leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882489U JPH0317650U (en) | 1989-07-04 | 1989-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882489U JPH0317650U (en) | 1989-07-04 | 1989-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317650U true JPH0317650U (en) | 1991-02-21 |
Family
ID=31622434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7882489U Pending JPH0317650U (en) | 1989-07-04 | 1989-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317650U (en) |
-
1989
- 1989-07-04 JP JP7882489U patent/JPH0317650U/ja active Pending