JPS6298241U - - Google Patents
Info
- Publication number
- JPS6298241U JPS6298241U JP18979685U JP18979685U JPS6298241U JP S6298241 U JPS6298241 U JP S6298241U JP 18979685 U JP18979685 U JP 18979685U JP 18979685 U JP18979685 U JP 18979685U JP S6298241 U JPS6298241 U JP S6298241U
- Authority
- JP
- Japan
- Prior art keywords
- package
- electrode
- package body
- view
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係るパツケージの
斜視図、第２図は第１図に示したＩＣパツケージ
の表面実装前の状態を示す断面図、第３図は第１
図に示したＩＣパツケージの表面実装後の状態を
示す断面図、第４図は本考案の第２実施例に係る
ＩＣパツケージの斜視図、第５図は第４図に示し
たＩＣパツケージの表面実装前の状態を示す断面
図、第６図は第４図に示したＩＣパツケージの表
面実装後の状態を示す断面図、第７図及び第８図
は従来技術を示す斜視図である。
１０，２０…パツケージ本体、１２，２２…電
極、１３，２３…凹部、１４…半田。
FIG. 1 is a perspective view of a package according to an embodiment of the present invention, FIG. 2 is a sectional view showing the state of the IC package shown in FIG. 1 before surface mounting, and FIG.
4 is a perspective view of the IC package according to the second embodiment of the present invention, and FIG. 5 is the surface of the IC package shown in FIG. 4. FIG. 6 is a cross-sectional view showing the state before mounting, FIG. 6 is a cross-sectional view showing the state of the IC package shown in FIG. 4 after surface mounting, and FIGS. 7 and 8 are perspective views showing the prior art. DESCRIPTION OF SYMBOLS 10, 20... Package body, 12, 22... Electrode, 13, 23... Recessed part, 14... Solder.
Claims (1)
よう凹部が形成された電極とから成り、 該電極を前記パツケージ本体の底面に配置した
ことを特徴とするＩＣパツケージ。[Claims for Utility Model Registration] An IC package comprising a package body and an electrode having a recess formed therein so that solder can be attached, and the electrode is disposed on the bottom surface of the package body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18979685U JPS6298241U (en) | 1985-12-10 | 1985-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18979685U JPS6298241U (en) | 1985-12-10 | 1985-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6298241U true JPS6298241U (en) | 1987-06-23 |
Family
ID=31142412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18979685U Pending JPS6298241U (en) | 1985-12-10 | 1985-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298241U (en) |
-
1985
- 1985-12-10 JP JP18979685U patent/JPS6298241U/ja active Pending