JPS624135U - - Google Patents

Info

Publication number
JPS624135U
JPS624135U JP9427385U JP9427385U JPS624135U JP S624135 U JPS624135 U JP S624135U JP 9427385 U JP9427385 U JP 9427385U JP 9427385 U JP9427385 U JP 9427385U JP S624135 U JPS624135 U JP S624135U
Authority
JP
Japan
Prior art keywords
package body
terminal
bent part
package
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9427385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9427385U priority Critical patent/JPS624135U/ja
Publication of JPS624135U publication Critical patent/JPS624135U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を心す図であつて、
aは側面断面図、bは平面図、第2図、第3図は
本考案の他の実施例を示す図であつて、第3図a
は側面断面図、第3図bは斜視図、第4図は従来
例を示す図であつて、aは側面図、bは平面図で
ある。 1……パツケージ本体、3……曲げ部、6……
箱体、7……閉塞部、8……壁部。
FIG. 1 is a diagram illustrating an embodiment of the present invention.
a is a side sectional view, b is a plan view, FIGS. 2 and 3 are views showing other embodiments of the present invention, and FIG.
3 is a side sectional view, FIG. 3b is a perspective view, and FIG. 4 is a diagram showing a conventional example, in which a is a side view and b is a plan view. 1...Package body, 3...Bending part, 6...
Box body, 7...Closing part, 8... Wall part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージ本体と、前記パツケージ本体の側部
より突出し、先端部が前記パツケージ本体の底面
と略同一面に形成された端子と、前記端子に形成
された曲げ部と、前記曲げ部とパツケージ本体と
によつて形成される空隙に半田が付着するのを防
止する半田付着防止手段とを備えたことを特徴と
するフラツトパツケージ型IC。
A package body, a terminal that protrudes from the side of the package body and has a tip formed on the same plane as the bottom surface of the package body, a bent part formed in the terminal, and the bent part and the package body. A flat package type IC characterized by comprising a solder adhesion prevention means for preventing solder from adhering to the gap thus formed.
JP9427385U 1985-06-21 1985-06-21 Pending JPS624135U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9427385U JPS624135U (en) 1985-06-21 1985-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9427385U JPS624135U (en) 1985-06-21 1985-06-21

Publications (1)

Publication Number Publication Date
JPS624135U true JPS624135U (en) 1987-01-12

Family

ID=30652686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9427385U Pending JPS624135U (en) 1985-06-21 1985-06-21

Country Status (1)

Country Link
JP (1) JPS624135U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442595U (en) * 1990-08-13 1992-04-10
JPH0442596U (en) * 1990-08-13 1992-04-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442595U (en) * 1990-08-13 1992-04-10
JPH0442596U (en) * 1990-08-13 1992-04-10

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