JPS61173143U - - Google Patents
Info
- Publication number
- JPS61173143U JPS61173143U JP5646285U JP5646285U JPS61173143U JP S61173143 U JPS61173143 U JP S61173143U JP 5646285 U JP5646285 U JP 5646285U JP 5646285 U JP5646285 U JP 5646285U JP S61173143 U JPS61173143 U JP S61173143U
- Authority
- JP
- Japan
- Prior art keywords
- back surface
- semiconductor device
- same level
- sip type
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例に係るＳＩＰ型Ｉ
Ｃの平面図、同図ｂは同図ａの側面図、第２図ａ
は従来のＳＩＰ型ＩＣの平面図、同図ｂは同図ａ
の側面図、第３図ａは従来のＳＩＰ型ＩＣの平面
図、同図ｂは同図ａの側面図、第４図は第１図の
ＳＩＰ型ＩＣを絶縁性基板に実装した状態を示す
説明図である。
１１……ＩＣ本体、１２……リード端子、１３
……下面、１４……裏面、１５……ＳＩＰ型ＩＣ
、１６……絶縁性基板。
FIG. 1a shows a SIP type I according to an embodiment of the present invention.
A plan view of C, Figure b is a side view of Figure A, Figure 2 a.
is a plan view of a conventional SIP type IC, and figure b is a plan view of a conventional SIP type IC.
Figure 3a is a plan view of a conventional SIP type IC, Figure b is a side view of Figure a, and Figure 4 shows the SIP type IC of Figure 1 mounted on an insulating substrate. It is an explanatory diagram. 11...IC body, 12...Lead terminal, 13
... Bottom surface, 14 ... Back surface, 15 ... SIP type IC
, 16... Insulating substrate.
Claims (1)
壁に設けられ、先端部がＩＣ本体の裏面に対し同
一レベル以下となるように屈曲した複数のリード
端子とを具備することを特徴とする半導体装置。 (2) リード端子の先端部がＩＣ本体の裏面と同
一レベルであることを特徴とする実用新案登録請
求の範囲第１項記載の半導体装置。[Scope of Claim for Utility Model Registration] (1) A SIP type IC body, and a plurality of lead terminals provided on the side wall of the IC body and bent so that their tips are at or below the same level as the back surface of the IC body. A semiconductor device comprising: (2) The semiconductor device according to claim 1, wherein the tip of the lead terminal is at the same level as the back surface of the IC body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5646285U JPS61173143U (en) | 1985-04-16 | 1985-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5646285U JPS61173143U (en) | 1985-04-16 | 1985-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61173143U true JPS61173143U (en) | 1986-10-28 |
Family
ID=30580076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5646285U Pending JPS61173143U (en) | 1985-04-16 | 1985-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173143U (en) |
-
1985
- 1985-04-16 JP JP5646285U patent/JPS61173143U/ja active Pending