JPS61157357U - - Google Patents

Info

Publication number
JPS61157357U
JPS61157357U JP3980485U JP3980485U JPS61157357U JP S61157357 U JPS61157357 U JP S61157357U JP 3980485 U JP3980485 U JP 3980485U JP 3980485 U JP3980485 U JP 3980485U JP S61157357 U JPS61157357 U JP S61157357U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
case
circuit board
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3980485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3980485U priority Critical patent/JPS61157357U/ja
Publication of JPS61157357U publication Critical patent/JPS61157357U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本考案による混成集積回
路装置を示す平面図および断面図、第3図および
第4図は従来の混成集積回路装置を示す平面図お
よび断面図である。 1……端子、2……封着用ガラス、3……ケー
ス、4……パターン、5……集積回路基板、6…
…ワイヤボンデイング、7……ロー材、8……溝
1 and 2 are a plan view and a sectional view of a hybrid integrated circuit device according to the present invention, and FIGS. 3 and 4 are a plan view and a sectional view of a conventional hybrid integrated circuit device. DESCRIPTION OF SYMBOLS 1... Terminal, 2... Sealing glass, 3... Case, 4... Pattern, 5... Integrated circuit board, 6...
...Wire bonding, 7...Raw material, 8...Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の端子がガラス封着されたケース上に混成
集積回路基板をロー付けして構成される混成集積
回路装置において、前記ケース上の前記混成集積
回路基板端部に溝を設けたことを特徴とする混成
集積回路装置。
A hybrid integrated circuit device configured by brazing a hybrid integrated circuit board onto a case in which a plurality of terminals are sealed in glass, characterized in that a groove is provided at an end of the hybrid integrated circuit board on the case. hybrid integrated circuit device.
JP3980485U 1985-03-22 1985-03-22 Pending JPS61157357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3980485U JPS61157357U (en) 1985-03-22 1985-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3980485U JPS61157357U (en) 1985-03-22 1985-03-22

Publications (1)

Publication Number Publication Date
JPS61157357U true JPS61157357U (en) 1986-09-30

Family

ID=30548096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3980485U Pending JPS61157357U (en) 1985-03-22 1985-03-22

Country Status (1)

Country Link
JP (1) JPS61157357U (en)

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