JPH0361303U - - Google Patents
Info
- Publication number
- JPH0361303U JPH0361303U JP12351289U JP12351289U JPH0361303U JP H0361303 U JPH0361303 U JP H0361303U JP 12351289 U JP12351289 U JP 12351289U JP 12351289 U JP12351289 U JP 12351289U JP H0361303 U JPH0361303 U JP H0361303U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- adhesive
- alumina
- ceramic
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第１図は本考案の一実施例によるチツプ部品の
平面図、第２図は同側面図、第３図、第４図はそ
れぞれ従来のチツプ部品の平面図、側面図である
。
２……チツプ、３……接着剤、４……絶縁基板
、４ａ，４ｂ……金属端子、４ｃ……側面電極。
FIG. 1 is a plan view of a chip component according to an embodiment of the present invention, FIG. 2 is a side view of the same, and FIGS. 3 and 4 are a plan view and a side view, respectively, of conventional chip components. 2... Chip, 3... Adhesive, 4... Insulating substrate, 4a, 4b... Metal terminal, 4c... Side electrode.
Claims (1)
部を設けたアルミナ、ガラスエポキシ等の絶縁基
板と、上記絶縁基板上に接着により固定されたセ
ラミツク、プラスチツク等のキヤツプとから成り
、上記絶縁基板の側面に形成したほぼコ字状の凹
部に側面電極部を形成したことを特徴とするチツ
プ部品。 It consists of an insulating substrate made of alumina, glass epoxy, etc., which is provided with a plurality of metal terminals over at least the top and bottom surfaces, and a cap made of ceramic, plastic, etc. that is fixed by adhesive on the insulating substrate, and is attached to the side surface of the insulating substrate. A chip component characterized in that a side electrode portion is formed in a substantially U-shaped recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12351289U JPH0361303U (en) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12351289U JPH0361303U (en) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361303U true JPH0361303U (en) | 1991-06-17 |
Family
ID=31671486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12351289U Pending JPH0361303U (en) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361303U (en) |
-
1989
- 1989-10-20 JP JP12351289U patent/JPH0361303U/ja active Pending