JPH0371647U - - Google Patents

Info

Publication number
JPH0371647U
JPH0371647U JP13322589U JP13322589U JPH0371647U JP H0371647 U JPH0371647 U JP H0371647U JP 13322589 U JP13322589 U JP 13322589U JP 13322589 U JP13322589 U JP 13322589U JP H0371647 U JPH0371647 U JP H0371647U
Authority
JP
Japan
Prior art keywords
chip carrier
glass epoxy
stepped
contact portion
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13322589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13322589U priority Critical patent/JPH0371647U/ja
Publication of JPH0371647U publication Critical patent/JPH0371647U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bは本考案の第1の実施例の平面図
及び側面図、第2図a,bは本考案の第2の実施
例の平面図及び側面図、第3図a,bは従来のチ
ツプキヤリアの一例の平面図及び側面図である。 1……ガラスエポキシ基板、2……樹脂コート
、3……コンタクト部、4……セラミツクケース
、5……セラミツクキヤツプ。
Figure 1 a, b is a plan view and side view of the first embodiment of the present invention, Figure 2 a, b is a plan view and side view of the second embodiment of the present invention, Figure 3 a, b 1 is a plan view and a side view of an example of a conventional chip carrier. DESCRIPTION OF SYMBOLS 1...Glass epoxy board, 2...Resin coat, 3...Contact part, 4...Ceramic case, 5...Ceramic cap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ガラスエポキシ基板又はセラミツク基板で形成
されるチツプキヤリアにおいて、前記チツプキヤ
リアの4辺のそれぞれを逆階段状に段にして該段
の各側面に外部とのコンタクト部を設けたことを
特徴とするチツプキヤリア。
1. A chip carrier formed of a glass epoxy substrate or a ceramic substrate, characterized in that each of the four sides of the chip carrier is stepped in the form of a reverse staircase, and a contact portion with the outside is provided on each side of the step.
JP13322589U 1989-11-15 1989-11-15 Pending JPH0371647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13322589U JPH0371647U (en) 1989-11-15 1989-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13322589U JPH0371647U (en) 1989-11-15 1989-11-15

Publications (1)

Publication Number Publication Date
JPH0371647U true JPH0371647U (en) 1991-07-19

Family

ID=31680635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13322589U Pending JPH0371647U (en) 1989-11-15 1989-11-15

Country Status (1)

Country Link
JP (1) JPH0371647U (en)

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