JPH0238742U - - Google Patents
Info
- Publication number
- JPH0238742U JPH0238742U JP11811588U JP11811588U JPH0238742U JP H0238742 U JPH0238742 U JP H0238742U JP 11811588 U JP11811588 U JP 11811588U JP 11811588 U JP11811588 U JP 11811588U JP H0238742 U JPH0238742 U JP H0238742U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- board
- connection pads
- glass epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
Description
第１図ａ，ｂはそれぞれ本考案の一実施例を示
す平面図及び側面図、第２図ａ，ｂはそれぞれ従
来チツプキヤリア用基板の平面図及び側面図であ
る。
１……ガラスエポキシ基板、２……配線パター
ン、３……マウントランド、４……外部との接続
パツド。
1A and 1B are a plan view and a side view, respectively, showing an embodiment of the present invention, and FIGS. 2A and 2B are a plan view and a side view, respectively, of a conventional chip carrier substrate. 1...Glass epoxy board, 2...Wiring pattern, 3...Mount land, 4...External connection pad.
Claims (1)
板で形成され該基板の側面に外部との接続パツド
を有するチヤツプキヤリア用基板において、基板
の側面に垂直に凹部を設け、前記凹部及び前記凹
部に隣接する凸部の、前記基板の側面と同方向の
面に前記外部との接続パツドをそれぞれ設けるこ
とを特徴とするチツプキヤリア用基板。 In a cap carrier substrate formed of a glass epoxy substrate or an alumina ceramic substrate and having external connection pads on the side surface of the substrate, a recess is provided perpendicularly to the side surface of the substrate, and the recess and the convex portion adjacent to the recess are A board for a chip carrier, characterized in that the connection pads for connection with the outside are provided on a surface in the same direction as a side surface of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11811588U JPH0238742U (en) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11811588U JPH0238742U (en) | 1988-09-07 | 1988-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238742U true JPH0238742U (en) | 1990-03-15 |
Family
ID=31362187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11811588U Pending JPH0238742U (en) | 1988-09-07 | 1988-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238742U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459621U (en) * | 1990-09-29 | 1992-05-21 | ||
| JPH05275561A (en) * | 1992-03-25 | 1993-10-22 | Nec Corp | Leadless chip carrier board |
-
1988
- 1988-09-07 JP JP11811588U patent/JPH0238742U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459621U (en) * | 1990-09-29 | 1992-05-21 | ||
| JPH05275561A (en) * | 1992-03-25 | 1993-10-22 | Nec Corp | Leadless chip carrier board |