JPH01179436U - - Google Patents
Info
- Publication number
- JPH01179436U JPH01179436U JP7654588U JP7654588U JPH01179436U JP H01179436 U JPH01179436 U JP H01179436U JP 7654588 U JP7654588 U JP 7654588U JP 7654588 U JP7654588 U JP 7654588U JP H01179436 U JPH01179436 U JP H01179436U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- flexible printed
- printed board
- positioning
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013039 cover film Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
同上の断面図、第３図は従来例の平面図、第４図
は同上の断面図、第５図は本考案の他の実施例の
平面図、第６図ａは他の従来例の平面図、同図ｂ
は同上のＡ−Ａ′線についての断面図である。
１はフレキシブルプリント板、２はＩＣチツプ
、３はカバーフイルム、４ａは抜き穴パターンで
ある。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a sectional view of the same as above, Fig. 3 is a plan view of a conventional example, Fig. 4 is a sectional view of the same as above, and Fig. 5 is a sectional view of the same as the above. FIG. 6a is a plan view of another conventional example, and FIG. 6b is a plan view of another conventional example.
is a sectional view taken along line A-A' of the same. 1 is a flexible printed board, 2 is an IC chip, 3 is a cover film, and 4a is a hole pattern.
Claims (1)
めしてダイボンドする構造において、フレキシブ
ルプリント板に絶縁層を形成するためのカバーフ
イルムに、ＩＣチツプの位置決め用の抜き穴パタ
ーンを形成したことを特徴とするＩＣチツプの位
置決め構造。 An IC chip having a structure in which an IC chip is positioned and die-bonded to a flexible printed board, wherein a hole pattern for positioning the IC chip is formed in a cover film for forming an insulating layer on the flexible printed board. Positioning structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7654588U JPH01179436U (en) | 1988-06-09 | 1988-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7654588U JPH01179436U (en) | 1988-06-09 | 1988-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179436U true JPH01179436U (en) | 1989-12-22 |
Family
ID=31301566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7654588U Pending JPH01179436U (en) | 1988-06-09 | 1988-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179436U (en) |
-
1988
- 1988-06-09 JP JP7654588U patent/JPH01179436U/ja active Pending