JPH01179436U - - Google Patents

Info

Publication number
JPH01179436U
JPH01179436U JP7654588U JP7654588U JPH01179436U JP H01179436 U JPH01179436 U JP H01179436U JP 7654588 U JP7654588 U JP 7654588U JP 7654588 U JP7654588 U JP 7654588U JP H01179436 U JPH01179436 U JP H01179436U
Authority
JP
Japan
Prior art keywords
chip
flexible printed
printed board
positioning
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7654588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7654588U priority Critical patent/JPH01179436U/ja
Publication of JPH01179436U publication Critical patent/JPH01179436U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の平面図、第2図は
同上の断面図、第3図は従来例の平面図、第4図
は同上の断面図、第5図は本考案の他の実施例の
平面図、第6図aは他の従来例の平面図、同図b
は同上のA−A′線についての断面図である。 1はフレキシブルプリント板、2はICチツプ
、3はカバーフイルム、4aは抜き穴パターンで
ある。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a sectional view of the same as above, Fig. 3 is a plan view of a conventional example, Fig. 4 is a sectional view of the same as above, and Fig. 5 is a sectional view of the same as the above. FIG. 6a is a plan view of another conventional example, and FIG. 6b is a plan view of another conventional example.
is a sectional view taken along line A-A' of the same. 1 is a flexible printed board, 2 is an IC chip, 3 is a cover film, and 4a is a hole pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フレキシブルプリント板にICチツプを位置決
めしてダイボンドする構造において、フレキシブ
ルプリント板に絶縁層を形成するためのカバーフ
イルムに、ICチツプの位置決め用の抜き穴パタ
ーンを形成したことを特徴とするICチツプの位
置決め構造。
An IC chip having a structure in which an IC chip is positioned and die-bonded to a flexible printed board, wherein a hole pattern for positioning the IC chip is formed in a cover film for forming an insulating layer on the flexible printed board. Positioning structure.
JP7654588U 1988-06-09 1988-06-09 Pending JPH01179436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7654588U JPH01179436U (en) 1988-06-09 1988-06-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7654588U JPH01179436U (en) 1988-06-09 1988-06-09

Publications (1)

Publication Number Publication Date
JPH01179436U true JPH01179436U (en) 1989-12-22

Family

ID=31301566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7654588U Pending JPH01179436U (en) 1988-06-09 1988-06-09

Country Status (1)

Country Link
JP (1) JPH01179436U (en)

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